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Artigo de periodico
The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs (2017)
Bordallo, Caio Cesar Mendes ; Collaert, Nadine ; Claeys, Cor ; Simoen, Eddy ; Vandooren, A; Rooyackers, Rita; Mols, Yannick; Alian, A; Agopian, Paula Ghedini Der ; Martino, João Antonio
Source: IEEE Transactions on Electron Devices. Unidade: EP
Subjects: MICROELETRÔNICA, SEMICONDUTORES
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ABNT
BORDALLO, Caio Cesar Mendes et al. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs. IEEE Transactions on Electron Devices, v. 64, n. 9, p. 3595-3600, 2017Tradução . . Disponível em: https://doi.org/10.1109/ted.2017.2721110. Acesso em: 09 out. 2024.
APA
Bordallo, C. C. M., Collaert, N., Claeys, C., Simoen, E., Vandooren, A., Rooyackers, R., et al. (2017). The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs. IEEE Transactions on Electron Devices, 64( 9), 3595-3600. doi:10.1109/ted.2017.2721110
NLM
Bordallo CCM, Collaert N, Claeys C, Simoen E, Vandooren A, Rooyackers R, Mols Y, Alian A, Agopian PGD, Martino JA. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs [Internet]. IEEE Transactions on Electron Devices. 2017 ; 64( 9): 3595-3600.[citado 2024 out. 09 ] Available from: https://doi.org/10.1109/ted.2017.2721110
Vancouver
Bordallo CCM, Collaert N, Claeys C, Simoen E, Vandooren A, Rooyackers R, Mols Y, Alian A, Agopian PGD, Martino JA. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs [Internet]. IEEE Transactions on Electron Devices. 2017 ; 64( 9): 3595-3600.[citado 2024 out. 09 ] Available from: https://doi.org/10.1109/ted.2017.2721110
Artigo de periodico
Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes (2016)
Oliveira, Alberto Vinicius de; Simoen, Eddy ; Mitard Jerome; Agopian, Paula Ghedini Der ; Langer, Robert; Witters, Liesbeth J; Martino, João Antonio
Source: IEEE Transactions on Electron Devices. Unidade: EP
Subjects: MICROELETRÔNICA, SILÍCIO
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ABNT
OLIVEIRA, Alberto Vinicius de et al. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes. IEEE Transactions on Electron Devices, v. 63, n. 10, p. 4031-4037, 2016Tradução . . Disponível em: https://doi.org/10.1109/ted.2016.2598288. Acesso em: 09 out. 2024.
APA
Oliveira, A. V. de, Simoen, E., Mitard Jerome,, Agopian, P. G. D., Langer, R., Witters, L. J., & Martino, J. A. (2016). Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes. IEEE Transactions on Electron Devices, 63( 10), 4031-4037. doi:10.1109/ted.2016.2598288
NLM
Oliveira AV de, Simoen E, Mitard Jerome, Agopian PGD, Langer R, Witters LJ, Martino JA. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes [Internet]. IEEE Transactions on Electron Devices. 2016 ; 63( 10): 4031-4037.[citado 2024 out. 09 ] Available from: https://doi.org/10.1109/ted.2016.2598288
Vancouver
Oliveira AV de, Simoen E, Mitard Jerome, Agopian PGD, Langer R, Witters LJ, Martino JA. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes [Internet]. IEEE Transactions on Electron Devices. 2016 ; 63( 10): 4031-4037.[citado 2024 out. 09 ] Available from: https://doi.org/10.1109/ted.2016.2598288
Artigo de periodico
Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes (2016)
Oliveira, Alberto Vinicius de; Agopian, Paula Ghedini Der ; Simoen, Eddy ; Langer, Robert; Collaert, Nadine ; Thean, Aaron; Claeys, Cor ; Martino, João Antonio
Source: Semiconductor Science and Technology. Unidade: EP
Subjects: SEMICONDUTORES, MICROELETRÔNICA
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ABNT
OLIVEIRA, Alberto Vinicius de et al. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes. Semiconductor Science and Technology, v. 31, n. 11, p. 114002 , 2016Tradução . . Disponível em: https://doi.org/10.1088/0268-1242/31/11/114002. Acesso em: 09 out. 2024.
APA
Oliveira, A. V. de, Agopian, P. G. D., Simoen, E., Langer, R., Collaert, N., Thean, A., et al. (2016). Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes. Semiconductor Science and Technology, 31( 11), 114002 . doi:10.1088/0268-1242/31/11/114002
NLM
Oliveira AV de, Agopian PGD, Simoen E, Langer R, Collaert N, Thean A, Claeys C, Martino JA. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes [Internet]. Semiconductor Science and Technology. 2016 ; 31( 11): 114002 .[citado 2024 out. 09 ] Available from: https://doi.org/10.1088/0268-1242/31/11/114002
Vancouver
Oliveira AV de, Agopian PGD, Simoen E, Langer R, Collaert N, Thean A, Claeys C, Martino JA. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes [Internet]. Semiconductor Science and Technology. 2016 ; 31( 11): 114002 .[citado 2024 out. 09 ] Available from: https://doi.org/10.1088/0268-1242/31/11/114002
Artigo de periodico
Impact of Gate Stack Layer Composition on Dynamic Threshold Voltage and Analog Parameters of Ge pMOSFETs (2016)
Oliveira, Alberto Vinicius de; Simoen, Eddy ; Thean, Aaron; Agopian, Paula Ghedini Der ; Martino, João Antonio ; Claeys, Cor ; Mertens, Hans; Collaert, Nadine
Source: ECS Transactions volume 66 issue 5 on pages 309 to 314. Unidade: EP
Subjects: MICROELETRÔNICA, TRANSISTORES
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ABNT
OLIVEIRA, Alberto Vinicius de et al. Impact of Gate Stack Layer Composition on Dynamic Threshold Voltage and Analog Parameters of Ge pMOSFETs. ECS Transactions volume 66 issue 5 on pages 309 to 314, v. 66, n. 5, p. 309-314, 2016Tradução . . Disponível em: https://doi.org/10.1149/06605.0309ecst. Acesso em: 09 out. 2024.
APA
Oliveira, A. V. de, Simoen, E., Thean, A., Agopian, P. G. D., Martino, J. A., Claeys, C., et al. (2016). Impact of Gate Stack Layer Composition on Dynamic Threshold Voltage and Analog Parameters of Ge pMOSFETs. ECS Transactions volume 66 issue 5 on pages 309 to 314, 66( 5), 309-314. doi:10.1149/06605.0309ecst
NLM
Oliveira AV de, Simoen E, Thean A, Agopian PGD, Martino JA, Claeys C, Mertens H, Collaert N. Impact of Gate Stack Layer Composition on Dynamic Threshold Voltage and Analog Parameters of Ge pMOSFETs [Internet]. ECS Transactions volume 66 issue 5 on pages 309 to 314. 2016 ; 66( 5): 309-314.[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/06605.0309ecst
Vancouver
Oliveira AV de, Simoen E, Thean A, Agopian PGD, Martino JA, Claeys C, Mertens H, Collaert N. Impact of Gate Stack Layer Composition on Dynamic Threshold Voltage and Analog Parameters of Ge pMOSFETs [Internet]. ECS Transactions volume 66 issue 5 on pages 309 to 314. 2016 ; 66( 5): 309-314.[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/06605.0309ecst
Artigo de periodico
Comparative analysis of the intrinsic voltage gain and unit gain frequency between SOI and bulk FinFETs up to high temperatures (2016)
Oliveira, Alberto Vinicius de; Collaert, Nadine ; Thean, Aaron; Claeys, Cor ; Simoen, Eddy ; Agopian, Paula Ghedini Der ; Martino, João Antonio
Source: Solid-State Electronics. Unidade: EP
Subjects: SEMICONDUTORES, MICROELETRÔNICA
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ABNT
OLIVEIRA, Alberto Vinicius de et al. Comparative analysis of the intrinsic voltage gain and unit gain frequency between SOI and bulk FinFETs up to high temperatures. Solid-State Electronics, v. 123, p. 124-129, 2016Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2016.05.004. Acesso em: 09 out. 2024.
APA
Oliveira, A. V. de, Collaert, N., Thean, A., Claeys, C., Simoen, E., Agopian, P. G. D., & Martino, J. A. (2016). Comparative analysis of the intrinsic voltage gain and unit gain frequency between SOI and bulk FinFETs up to high temperatures. Solid-State Electronics, 123, 124-129. doi:10.1016/j.sse.2016.05.004
NLM
Oliveira AV de, Collaert N, Thean A, Claeys C, Simoen E, Agopian PGD, Martino JA. Comparative analysis of the intrinsic voltage gain and unit gain frequency between SOI and bulk FinFETs up to high temperatures [Internet]. Solid-State Electronics. 2016 ; 123 124-129.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2016.05.004
Vancouver
Oliveira AV de, Collaert N, Thean A, Claeys C, Simoen E, Agopian PGD, Martino JA. Comparative analysis of the intrinsic voltage gain and unit gain frequency between SOI and bulk FinFETs up to high temperatures [Internet]. Solid-State Electronics. 2016 ; 123 124-129.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2016.05.004
Artigo de periodico
Enhanced dynamic threshold voltage UTBB SOI nMOSFETs (2015)
Sasaki, Kátia Regina Akemi; Manini, Matheus Barros; Claeys, Cor ; Simoen, Eddy ; Martino, João Antonio
Source: Solid-State Electronics. Unidade: EP
Subjects: SEMICONDUTORES, MICROELETRÔNICA
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ABNT
SASAKI, Kátia Regina Akemi et al. Enhanced dynamic threshold voltage UTBB SOI nMOSFETs. Solid-State Electronics, v. 112, p. 19-23, 2015Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2015.02.011. Acesso em: 09 out. 2024.
APA
Sasaki, K. R. A., Manini, M. B., Claeys, C., Simoen, E., & Martino, J. A. (2015). Enhanced dynamic threshold voltage UTBB SOI nMOSFETs. Solid-State Electronics, 112, 19-23. doi:10.1016/j.sse.2015.02.011
NLM
Sasaki KRA, Manini MB, Claeys C, Simoen E, Martino JA. Enhanced dynamic threshold voltage UTBB SOI nMOSFETs [Internet]. Solid-State Electronics. 2015 ; 112 19-23.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2015.02.011
Vancouver
Sasaki KRA, Manini MB, Claeys C, Simoen E, Martino JA. Enhanced dynamic threshold voltage UTBB SOI nMOSFETs [Internet]. Solid-State Electronics. 2015 ; 112 19-23.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2015.02.011
Artigo de periodico
Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View (2015)
Sasaki, Kátia Regina Akemi; Aoulaiche, Marc; Simoen, Eddy ; Claeys, Cor ; Martino, João Antonio
Source: J. Low Power Electron. Appl. 2015, 5(2), 69-80. Unidade: EP
Assunto: MICROELETRÔNICA
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ABNT
SASAKI, Kátia Regina Akemi et al. Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View. J. Low Power Electron. Appl. 2015, 5(2), 69-80, v. 5, n. 2, p. 69-80, 2015Tradução . . Disponível em: https://doi.org/10.3390/jlpea5020069. Acesso em: 09 out. 2024.
APA
Sasaki, K. R. A., Aoulaiche, M., Simoen, E., Claeys, C., & Martino, J. A. (2015). Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View. J. Low Power Electron. Appl. 2015, 5(2), 69-80, 5( 2), 69-80. doi:10.3390/jlpea5020069
NLM
Sasaki KRA, Aoulaiche M, Simoen E, Claeys C, Martino JA. Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View [Internet]. J. Low Power Electron. Appl. 2015, 5(2), 69-80. 2015 ; 5( 2): 69-80.[citado 2024 out. 09 ] Available from: https://doi.org/10.3390/jlpea5020069
Vancouver
Sasaki KRA, Aoulaiche M, Simoen E, Claeys C, Martino JA. Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View [Internet]. J. Low Power Electron. Appl. 2015, 5(2), 69-80. 2015 ; 5( 2): 69-80.[citado 2024 out. 09 ] Available from: https://doi.org/10.3390/jlpea5020069
Artigo de periodico
In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs (2015)
Doria, Rodrigo Trevisoli ; Claeys, Cor ; Simoen, Eddy ; Souza, Marcio Alves Sodré de; Martino, João Antonio
Source: Microelectronic Engineering. Unidade: EP
Assunto: MICROELETRÔNICA
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ABNT
DORIA, Rodrigo Trevisoli et al. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs. Microelectronic Engineering, v. 147, n. 1, p. 92-95, 2015Tradução . . Disponível em: https://doi.org/10.1016/j.mee.2015.04.056. Acesso em: 09 out. 2024.
APA
Doria, R. T., Claeys, C., Simoen, E., Souza, M. A. S. de, & Martino, J. A. (2015). In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs. Microelectronic Engineering, 147( 1), 92-95. doi:10.1016/j.mee.2015.04.056
NLM
Doria RT, Claeys C, Simoen E, Souza MAS de, Martino JA. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs [Internet]. Microelectronic Engineering. 2015 ; 147( 1): 92-95.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.mee.2015.04.056
Vancouver
Doria RT, Claeys C, Simoen E, Souza MAS de, Martino JA. In-depth low frequency noise evaluation of substrate rotation and strain engineering in n-type triple gate SOI FinFETs [Internet]. Microelectronic Engineering. 2015 ; 147( 1): 92-95.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.mee.2015.04.056
Artigo de periodico
Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs (2015)
Bühler, Rudolf Theoderich; Agopian, Paula Ghedini Der ; Collaert, Nadine ; Simoen, Eddy ; Claeys, Cor ; Martino, João Antonio
Source: Solid-State Electronics. Unidade: EP
Assunto: MICROELETRÔNICA
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ABNT
BÜHLER, Rudolf Theoderich et al. Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs. Solid-State Electronics, v. 103, p. 209-215, 2015Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2014.07.010. Acesso em: 09 out. 2024.
APA
Bühler, R. T., Agopian, P. G. D., Collaert, N., Simoen, E., Claeys, C., & Martino, J. A. (2015). Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs. Solid-State Electronics, 103, 209-215. doi:10.1016/j.sse.2014.07.010
NLM
Bühler RT, Agopian PGD, Collaert N, Simoen E, Claeys C, Martino JA. Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs [Internet]. Solid-State Electronics. 2015 ;103 209-215.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2014.07.010
Vancouver
Bühler RT, Agopian PGD, Collaert N, Simoen E, Claeys C, Martino JA. Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs [Internet]. Solid-State Electronics. 2015 ;103 209-215.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2014.07.010
Artigo de periodico
Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism (2015)
Martino, Márcio Dalla Valle; Thean, Aaron; Claeys, Cor ; Neves, Felipe S; Agopian, Paula Ghedini Der ; Martino, João Antonio ; Vandooren, A; Rooyackers, Rita; Simoen, Eddy
Source: Solid-State Electronics. Unidade: EP
Subjects: TRANSISTORES, MICROELETRÔNICA
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ABNT
MARTINO, Márcio Dalla Valle et al. Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism. Solid-State Electronics, v. 112, p. 51-55, 2015Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2015.02.006. Acesso em: 09 out. 2024.
APA
Martino, M. D. V., Thean, A., Claeys, C., Neves, F. S., Agopian, P. G. D., Martino, J. A., et al. (2015). Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism. Solid-State Electronics, 112, 51-55. doi:10.1016/j.sse.2015.02.006
NLM
Martino MDV, Thean A, Claeys C, Neves FS, Agopian PGD, Martino JA, Vandooren A, Rooyackers R, Simoen E. Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism [Internet]. Solid-State Electronics. 2015 ; 112 51-55.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2015.02.006
Vancouver
Martino MDV, Thean A, Claeys C, Neves FS, Agopian PGD, Martino JA, Vandooren A, Rooyackers R, Simoen E. Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism [Internet]. Solid-State Electronics. 2015 ; 112 51-55.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2015.02.006
Artigo de periodico
Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation (2014)
Caño de Andrade, Maria Glória; Collaert, Nadine ; Simoen, Eddy ; Claeys, Cor ; Aoulaiche, Marc; Martino, João Antonio
Source: Microelectronics Reliability. Unidade: EP
Subjects: SILÍCIO, MICROELETRÔNICA
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ABNT
CAÑO DE ANDRADE, Maria Glória et al. Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation. Microelectronics Reliability, v. 54, n. 11, p. 2349-2354, 2014Tradução . . Disponível em: https://doi.org/10.1016/j.microrel.2014.06.013. Acesso em: 09 out. 2024.
APA
Caño de Andrade, M. G., Collaert, N., Simoen, E., Claeys, C., Aoulaiche, M., & Martino, J. A. (2014). Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation. Microelectronics Reliability, 54( 11), 2349-2354. doi:10.1016/j.microrel.2014.06.013
NLM
Caño de Andrade MG, Collaert N, Simoen E, Claeys C, Aoulaiche M, Martino JA. Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation [Internet]. Microelectronics Reliability. 2014 ; 54( 11): 2349-2354.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.microrel.2014.06.013
Vancouver
Caño de Andrade MG, Collaert N, Simoen E, Claeys C, Aoulaiche M, Martino JA. Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation [Internet]. Microelectronics Reliability. 2014 ; 54( 11): 2349-2354.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.microrel.2014.06.013
Artigo de periodico
Parasitic conduction response to X-ray radiation in unstrained and strained triple-gate SOI MuGFETs (2014)
Teixeira, Fernando Ferrari; Martino, João Antonio ; Bordallo, Caio Cesar Mendes ; Silveira, Marcilei Aparecida Guazzelli da; Agopian, Paula Ghedini Der ; Simoen, Eddy ; Claeys, Cor
Source: Journal of Integrated Circuits and Systems. Unidade: EP
Subjects: MICROELETRÔNICA, RAIOS X
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ABNT
TEIXEIRA, Fernando Ferrari et al. Parasitic conduction response to X-ray radiation in unstrained and strained triple-gate SOI MuGFETs. Journal of Integrated Circuits and Systems, v. 9, n. 2, p. 97-102, 2014Tradução . . Disponível em: https://doi.org/10.29292/jics.v9i2.394. Acesso em: 09 out. 2024.
APA
Teixeira, F. F., Martino, J. A., Bordallo, C. C. M., Silveira, M. A. G. da, Agopian, P. G. D., Simoen, E., & Claeys, C. (2014). Parasitic conduction response to X-ray radiation in unstrained and strained triple-gate SOI MuGFETs. Journal of Integrated Circuits and Systems, 9( 2), 97-102. doi:10.29292/jics.v9i2.394
NLM
Teixeira FF, Martino JA, Bordallo CCM, Silveira MAG da, Agopian PGD, Simoen E, Claeys C. Parasitic conduction response to X-ray radiation in unstrained and strained triple-gate SOI MuGFETs [Internet]. Journal of Integrated Circuits and Systems. 2014 ; 9( 2): 97-102.[citado 2024 out. 09 ] Available from: https://doi.org/10.29292/jics.v9i2.394
Vancouver
Teixeira FF, Martino JA, Bordallo CCM, Silveira MAG da, Agopian PGD, Simoen E, Claeys C. Parasitic conduction response to X-ray radiation in unstrained and strained triple-gate SOI MuGFETs [Internet]. Journal of Integrated Circuits and Systems. 2014 ; 9( 2): 97-102.[citado 2024 out. 09 ] Available from: https://doi.org/10.29292/jics.v9i2.394
Artigo de periodico
Analog performance of standard and uniaxial strained triple-gate SOI FinFETs under x-ray radiation (2014)
Bordallo, Caio Cesar Mendes ; Martino, João Antonio ; Teixeira, Fernando Ferrari; Silveira, Marcilei Aparecida Guazzelli da; Agopian, Paula Ghedini Der ; Simoen, Eddy ; Claeys, Cor
Source: Semiconductor Science and Technology. Unidade: EP
Subjects: RAIOS X, MICROELETRÔNICA
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ABNT
BORDALLO, Caio Cesar Mendes et al. Analog performance of standard and uniaxial strained triple-gate SOI FinFETs under x-ray radiation. Semiconductor Science and Technology, v. 29, n. 12, p. 125015, 2014Tradução . . Disponível em: https://doi.org/10.1088/0268-1242/29/12/125015. Acesso em: 09 out. 2024.
APA
Bordallo, C. C. M., Martino, J. A., Teixeira, F. F., Silveira, M. A. G. da, Agopian, P. G. D., Simoen, E., & Claeys, C. (2014). Analog performance of standard and uniaxial strained triple-gate SOI FinFETs under x-ray radiation. Semiconductor Science and Technology, 29( 12), 125015. doi:10.1088/0268-1242/29/12/125015
NLM
Bordallo CCM, Martino JA, Teixeira FF, Silveira MAG da, Agopian PGD, Simoen E, Claeys C. Analog performance of standard and uniaxial strained triple-gate SOI FinFETs under x-ray radiation [Internet]. Semiconductor Science and Technology. 2014 ; 29( 12): 125015.[citado 2024 out. 09 ] Available from: https://doi.org/10.1088/0268-1242/29/12/125015
Vancouver
Bordallo CCM, Martino JA, Teixeira FF, Silveira MAG da, Agopian PGD, Simoen E, Claeys C. Analog performance of standard and uniaxial strained triple-gate SOI FinFETs under x-ray radiation [Internet]. Semiconductor Science and Technology. 2014 ; 29( 12): 125015.[citado 2024 out. 09 ] Available from: https://doi.org/10.1088/0268-1242/29/12/125015
Artigo de periodico
Advantages of different source/drain engineering on scaled UTBOX FDSOI nMOSFETs at high temperature operation (2014)
Nicoletti, Talitha; Santos, Sara Dereste dos; Martino, João Antonio ; Aoulaiche, Marc; Veloso, Anabela; Claeys, Cor ; Simoen, Eddy ; Jurczak, Malgorzata
Source: Solid-State Electronics. Unidade: EP
Subjects: TEMPERATURA, MICROELETRÔNICA
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ABNT
NICOLETTI, Talitha et al. Advantages of different source/drain engineering on scaled UTBOX FDSOI nMOSFETs at high temperature operation. Solid-State Electronics, v. 91, p. 53-58, 2014Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2013.09.012. Acesso em: 09 out. 2024.
APA
Nicoletti, T., Santos, S. D. dos, Martino, J. A., Aoulaiche, M., Veloso, A., Claeys, C., et al. (2014). Advantages of different source/drain engineering on scaled UTBOX FDSOI nMOSFETs at high temperature operation. Solid-State Electronics, 91, 53-58. doi:10.1016/j.sse.2013.09.012
NLM
Nicoletti T, Santos SD dos, Martino JA, Aoulaiche M, Veloso A, Claeys C, Simoen E, Jurczak M. Advantages of different source/drain engineering on scaled UTBOX FDSOI nMOSFETs at high temperature operation [Internet]. Solid-State Electronics. 2014 ; 91 53-58.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2013.09.012
Vancouver
Nicoletti T, Santos SD dos, Martino JA, Aoulaiche M, Veloso A, Claeys C, Simoen E, Jurczak M. Advantages of different source/drain engineering on scaled UTBOX FDSOI nMOSFETs at high temperature operation [Internet]. Solid-State Electronics. 2014 ; 91 53-58.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.sse.2013.09.012
Artigo de periodico
Observation of the Two-Sided Read Window on UTBOX SOI 1T-DRAM: Measurement Setup, Numerical and Empirical Results (2014)
Nissimoff, Albert; Claeys, Cor ; Aoulaiche, Marc; Sasaki, Karen Lucia Mayumi; Simoen, Eddy ; Martino, João Antonio
Source: Journal of Integrated Circuits and Systems. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
NISSIMOFF, Albert et al. Observation of the Two-Sided Read Window on UTBOX SOI 1T-DRAM: Measurement Setup, Numerical and Empirical Results. Journal of Integrated Circuits and Systems, v. 9, n. 2, p. 91-96, 2014Tradução . . Disponível em: https://doi.org/10.29292/jics.v9i2.393. Acesso em: 09 out. 2024.
APA
Nissimoff, A., Claeys, C., Aoulaiche, M., Sasaki, K. L. M., Simoen, E., & Martino, J. A. (2014). Observation of the Two-Sided Read Window on UTBOX SOI 1T-DRAM: Measurement Setup, Numerical and Empirical Results. Journal of Integrated Circuits and Systems, 9( 2), 91-96. doi:10.29292/jics.v9i2.393
NLM
Nissimoff A, Claeys C, Aoulaiche M, Sasaki KLM, Simoen E, Martino JA. Observation of the Two-Sided Read Window on UTBOX SOI 1T-DRAM: Measurement Setup, Numerical and Empirical Results [Internet]. Journal of Integrated Circuits and Systems. 2014 ; 9( 2): 91-96.[citado 2024 out. 09 ] Available from: https://doi.org/10.29292/jics.v9i2.393
Vancouver
Nissimoff A, Claeys C, Aoulaiche M, Sasaki KLM, Simoen E, Martino JA. Observation of the Two-Sided Read Window on UTBOX SOI 1T-DRAM: Measurement Setup, Numerical and Empirical Results [Internet]. Journal of Integrated Circuits and Systems. 2014 ; 9( 2): 91-96.[citado 2024 out. 09 ] Available from: https://doi.org/10.29292/jics.v9i2.393
Trabalho de evento
Influence of interface trap density on vertical NW-TFETs with different source composition (2013)
Martino, João Antonio ; Souza, Felipe Neves; Agopian, Paula Ghedini Der ; Rooyackers, Rita; Vandooren, A.; Simoen, Eddy ; Claeys, Cor
Source: EUROSOI 2013. Conference titles: European Workshop on Silicon on Insulator Technology, Devices and Circuits. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
MARTINO, João Antonio et al. Influence of interface trap density on vertical NW-TFETs with different source composition. 2013, Anais.. Paris: Institut Superieur d'Électronique, 2013. . Acesso em: 09 out. 2024.
APA
Martino, J. A., Souza, F. N., Agopian, P. G. D., Rooyackers, R., Vandooren, A., Simoen, E., & Claeys, C. (2013). Influence of interface trap density on vertical NW-TFETs with different source composition. In EUROSOI 2013. Paris: Institut Superieur d'Électronique.
NLM
Martino JA, Souza FN, Agopian PGD, Rooyackers R, Vandooren A, Simoen E, Claeys C. Influence of interface trap density on vertical NW-TFETs with different source composition. EUROSOI 2013. 2013 ;[citado 2024 out. 09 ]
Vancouver
Martino JA, Souza FN, Agopian PGD, Rooyackers R, Vandooren A, Simoen E, Claeys C. Influence of interface trap density on vertical NW-TFETs with different source composition. EUROSOI 2013. 2013 ;[citado 2024 out. 09 ]
Artigo de periodico
RTN assessment of traps in polysilicon cylindrical vertical FETs for NVM application (2013)
Caño de Andrade, Maria Glória; Martino, João Antonio ; Toledano, M; Fourati, Fatima; Degraeve, Robin; Claeys, Cor ; Simoen, Eddy ; Van den Bosch, Geert; Van Houdt, Jan
Source: Microelectronic Engineering Volume 109, September 2013, Pages 105-108. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
CAÑO DE ANDRADE, Maria Glória et al. RTN assessment of traps in polysilicon cylindrical vertical FETs for NVM application. Microelectronic Engineering Volume 109, September 2013, Pages 105-108, v. 109, p. 105-108, 2013Tradução . . Disponível em: https://doi.org/10.1016/j.mee.2013.03.019. Acesso em: 09 out. 2024.
APA
Caño de Andrade, M. G., Martino, J. A., Toledano, M., Fourati, F., Degraeve, R., Claeys, C., et al. (2013). RTN assessment of traps in polysilicon cylindrical vertical FETs for NVM application. Microelectronic Engineering Volume 109, September 2013, Pages 105-108, 109, 105-108. doi:10.1016/j.mee.2013.03.019
NLM
Caño de Andrade MG, Martino JA, Toledano M, Fourati F, Degraeve R, Claeys C, Simoen E, Van den Bosch G, Van Houdt J. RTN assessment of traps in polysilicon cylindrical vertical FETs for NVM application [Internet]. Microelectronic Engineering Volume 109, September 2013, Pages 105-108. 2013 ; 109 105-108.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.mee.2013.03.019
Vancouver
Caño de Andrade MG, Martino JA, Toledano M, Fourati F, Degraeve R, Claeys C, Simoen E, Van den Bosch G, Van Houdt J. RTN assessment of traps in polysilicon cylindrical vertical FETs for NVM application [Internet]. Microelectronic Engineering Volume 109, September 2013, Pages 105-108. 2013 ; 109 105-108.[citado 2024 out. 09 ] Available from: https://doi.org/10.1016/j.mee.2013.03.019
Trabalho de evento
On the variability of the low-frequency noise in UTBOX SOI nMOSFETs (2012)
Simoen, Eddy ; Caño de Andrade, Maria Glória ; Almeida, Luciano Mendes; Aoulaiche, Marc; Caillat, Christian; Jurczak, Malgorzata; Claeys, Cor
Source: Microelectronics technology and devices, SBMicro. Conference titles: International Symposium on Microelectronics Technology and Devices. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
SIMOEN, Eddy et al. On the variability of the low-frequency noise in UTBOX SOI nMOSFETs. 2012, Anais.. Pennington: Escola Politécnica, Universidade de São Paulo, 2012. Disponível em: https://doi.org/10.1149/04901.0051ecst. Acesso em: 09 out. 2024.
APA
Simoen, E., Caño de Andrade, M. G., Almeida, L. M., Aoulaiche, M., Caillat, C., Jurczak, M., & Claeys, C. (2012). On the variability of the low-frequency noise in UTBOX SOI nMOSFETs. In Microelectronics technology and devices, SBMicro. Pennington: Escola Politécnica, Universidade de São Paulo. doi:10.1149/04901.0051ecst
NLM
Simoen E, Caño de Andrade MG, Almeida LM, Aoulaiche M, Caillat C, Jurczak M, Claeys C. On the variability of the low-frequency noise in UTBOX SOI nMOSFETs [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/04901.0051ecst
Vancouver
Simoen E, Caño de Andrade MG, Almeida LM, Aoulaiche M, Caillat C, Jurczak M, Claeys C. On the variability of the low-frequency noise in UTBOX SOI nMOSFETs [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/04901.0051ecst
Trabalho de evento
Analog performance at room and low temperature of triple-gate devices: Bulk, DTMOS, BOI and SOI (2012)
Caño de Andrade, Maria Glória ; Martino, João Antonio ; Simoen, Eddy ; Claeys, Cor
Source: Microelectronics technology and devices, SBMicro. Conference titles: International Symposium on Microelectronics Technology and Devices. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
CAÑO DE ANDRADE, Maria Glória et al. Analog performance at room and low temperature of triple-gate devices: Bulk, DTMOS, BOI and SOI. 2012, Anais.. Pennington: Escola Politécnica, Universidade de São Paulo, 2012. Disponível em: https://doi.org/10.1149/04901.0111ecst. Acesso em: 09 out. 2024.
APA
Caño de Andrade, M. G., Martino, J. A., Simoen, E., & Claeys, C. (2012). Analog performance at room and low temperature of triple-gate devices: Bulk, DTMOS, BOI and SOI. In Microelectronics technology and devices, SBMicro. Pennington: Escola Politécnica, Universidade de São Paulo. doi:10.1149/04901.0111ecst
NLM
Caño de Andrade MG, Martino JA, Simoen E, Claeys C. Analog performance at room and low temperature of triple-gate devices: Bulk, DTMOS, BOI and SOI [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/04901.0111ecst
Vancouver
Caño de Andrade MG, Martino JA, Simoen E, Claeys C. Analog performance at room and low temperature of triple-gate devices: Bulk, DTMOS, BOI and SOI [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/04901.0111ecst
Trabalho de evento
Spacer length and tilt implantation influence on scaled UTBOX FD MOSFETS (2012)
Santos, Sara Dereste dos ; Nicoletti, Talitha; Aoulaiche, Marc; Martino, João Antonio ; Veloso, A; Jurczak, Malgorzata; Simoen, Eddy ; Claeys, Cor
Source: Microelectronics technology and devices, SBMicro. Conference titles: International Symposium on Microelectronics Technology and Devices. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
SANTOS, Sara Dereste dos et al. Spacer length and tilt implantation influence on scaled UTBOX FD MOSFETS. 2012, Anais.. Pennington: Escola Politécnica, Universidade de São Paulo, 2012. Disponível em: https://repositorio.usp.br/directbitstream/22d2dffe-4364-4c9f-87ae-bbce2402e1e6/3144801.pdf. Acesso em: 09 out. 2024.
APA
Santos, S. D. dos, Nicoletti, T., Aoulaiche, M., Martino, J. A., Veloso, A., Jurczak, M., et al. (2012). Spacer length and tilt implantation influence on scaled UTBOX FD MOSFETS. In Microelectronics technology and devices, SBMicro. Pennington: Escola Politécnica, Universidade de São Paulo. Recuperado de https://repositorio.usp.br/directbitstream/22d2dffe-4364-4c9f-87ae-bbce2402e1e6/3144801.pdf
NLM
Santos SD dos, Nicoletti T, Aoulaiche M, Martino JA, Veloso A, Jurczak M, Simoen E, Claeys C. Spacer length and tilt implantation influence on scaled UTBOX FD MOSFETS [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/22d2dffe-4364-4c9f-87ae-bbce2402e1e6/3144801.pdf
Vancouver
Santos SD dos, Nicoletti T, Aoulaiche M, Martino JA, Veloso A, Jurczak M, Simoen E, Claeys C. Spacer length and tilt implantation influence on scaled UTBOX FD MOSFETS [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/22d2dffe-4364-4c9f-87ae-bbce2402e1e6/3144801.pdf

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