Aspects of metal etching for interconnect technologies (1994)
- Authors:
- Autor USP: VERDONCK, PATRICK BERNARD - EP
- Unidade: EP
- Assunto: CIRCUITOS INTEGRADOS
- Language: Inglês
- Imprenta:
- Publisher: Sbmicro/Unicamp
- Publisher place: Campinas
- Date published: 1994
- Source:
- Conference titles: Brazilian Microelectronics School
-
ABNT
VERDONCK, Patrick Bernard e MEYNEN, H. Aspects of metal etching for interconnect technologies. 1994, Anais.. Campinas: Sbmicro/Unicamp, 1994. . Acesso em: 14 fev. 2026. -
APA
Verdonck, P. B., & Meynen, H. (1994). Aspects of metal etching for interconnect technologies. In Advanced Metallization for Vlsi/ulsi Applications: Proceedings. Campinas: Sbmicro/Unicamp. -
NLM
Verdonck PB, Meynen H. Aspects of metal etching for interconnect technologies. Advanced Metallization for Vlsi/ulsi Applications: Proceedings. 1994 ;[citado 2026 fev. 14 ] -
Vancouver
Verdonck PB, Meynen H. Aspects of metal etching for interconnect technologies. Advanced Metallization for Vlsi/ulsi Applications: Proceedings. 1994 ;[citado 2026 fev. 14 ] - The influence of electrode material on argon plasmas
- Estudo sobre danos induzidos por plasma
- The influence of diffusion of fluorine compounds for silicon lateral etching
- RF electrical measurements in plasma processing reactors
- Oxygen plasma etching mechanisms of resist
- Aluminium etching with CC14-N2 plasma
- Corrosão por plasma de espaçadores em óxido de silício
- Plasma etching of aluminium using BCl3-Cl2 mixtures. (em CD-Rom)
- Laser enhanced polymer etching in different ambients
- The effect of electrode materials on etching mechanisms
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