Characterization by coulometric reduction of surface chemical components formed on copper in fluorine-containing plasmas (2003)
- Authors:
- USP affiliated authors: VERDONCK, PATRICK BERNARD - EP ; AOKI, IDALINA VIEIRA - EP
- Unidade: EP
- Subjects: COBRE; CORROSÃO ATMOSFÉRICA; CORROSÃO DOS MATERIAIS; ELETROQUÍMICA; INIBIDORES DE CORROSÃO; METAIS (CONSERVAÇÃO); MICROSCOPIA ELETRÔNICA
- Language: Inglês
- Imprenta:
- Publisher place: Pennington
- Date published: 2003
- Source:
- Título: Electrochemical and Solid State Letters
- ISSN: 1099-0062
- Volume/Número/Paginação/Ano: v. 6, n. 12, p. B55-B58
-
ABNT
VILCA MELÉNDEZ, Hugo Antonio et al. Characterization by coulometric reduction of surface chemical components formed on copper in fluorine-containing plasmas. Electrochemical and Solid State Letters, v. 6, n. 12, p. B55-B58, 2003Tradução . . Acesso em: 12 nov. 2024. -
APA
Vilca Meléndez, H. A., Ruas, R., Verdonck, P. B., & Aoki, I. V. (2003). Characterization by coulometric reduction of surface chemical components formed on copper in fluorine-containing plasmas. Electrochemical and Solid State Letters, 6( 12), B55-B58. -
NLM
Vilca Meléndez HA, Ruas R, Verdonck PB, Aoki IV. Characterization by coulometric reduction of surface chemical components formed on copper in fluorine-containing plasmas. Electrochemical and Solid State Letters. 2003 ; 6( 12): B55-B58.[citado 2024 nov. 12 ] -
Vancouver
Vilca Meléndez HA, Ruas R, Verdonck PB, Aoki IV. Characterization by coulometric reduction of surface chemical components formed on copper in fluorine-containing plasmas. Electrochemical and Solid State Letters. 2003 ; 6( 12): B55-B58.[citado 2024 nov. 12 ] - Fluorine containing plasma etching surface chemical characterization by coulometric reduction
- Laser enhanced polymer etching in different ambients
- Desenvolvimento de um processo de corrosao de aluminio por plasma de cc14+n2
- Development and characterization of 'SI IND.3''N IND.4' plasma etching processes
- Estudo da impedancia do plasma num processo de corrosao
- The influence of electrode material on argon plasmas
- Study of power balance in electronegative capacitively coupled plasmas
- Aluminium etching with CC14-N2 plasma
- Tecnicas de medidas de espessura de filmes finos
- Characterization of SF6 plasmas by RF electrical measurements
How to cite
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
