Formation of nickel silicides onto (100) silicon wafer surfaces using a thin platinum interlayer (2003)
- Authors:
- Autor USP: SANTOS FILHO, SEBASTIAO GOMES DOS - EP
- Unidade: EP
- Assunto: MICROELETRÔNICA
- Language: Inglês
- Imprenta:
- Publisher: Electrochemical Society
- Publisher place: Pennington
- Date published: 2003
- ISBN: 1-56677-389-X
- Source:
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ABNT
REIS, Ronaldo Willian et al. Formation of nickel silicides onto (100) silicon wafer surfaces using a thin platinum interlayer. Microelectronic Technology and Devices SBMicro 2003. Tradução . Pennington: Electrochemical Society, 2003. . . Acesso em: 28 fev. 2026. -
APA
Reis, R. W., Santos Filho, S. G. dos, Doi, I., & Swart, J. W. (2003). Formation of nickel silicides onto (100) silicon wafer surfaces using a thin platinum interlayer. In Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society. -
NLM
Reis RW, Santos Filho SG dos, Doi I, Swart JW. Formation of nickel silicides onto (100) silicon wafer surfaces using a thin platinum interlayer. In: Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society; 2003. [citado 2026 fev. 28 ] -
Vancouver
Reis RW, Santos Filho SG dos, Doi I, Swart JW. Formation of nickel silicides onto (100) silicon wafer surfaces using a thin platinum interlayer. In: Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society; 2003. [citado 2026 fev. 28 ] - Nano-crystalline palladium-film catalysts deposited by e-beam evaporation aiming hydrogen sensing
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