Dynamic scaling of the surface roughness during electroless Cu plating onto Si in aqueous fluoride solution (2007)
- Authors:
- Autor USP: SANTOS FILHO, SEBASTIÃO GOMES DOS - EP
- Unidade: EP
- DOI: 10.1149/1.2766884
- Assunto: MICROELETRÔNICA
- Language: Inglês
- Imprenta:
- Publisher: The Electrochemical Society
- Publisher place: Pennington
- Date published: 2007
- Source:
- Título: SBMicro 2007
- ISSN: 1938-5862
- Conference titles: International Symposium on Microelectronics Technology and Devices SBMICRO
- Este periódico é de assinatura
- Este artigo NÃO é de acesso aberto
- Cor do Acesso Aberto: closed
-
ABNT
GOZZI, Giuliano e SANTOS FILHO, Sebastião Gomes dos. Dynamic scaling of the surface roughness during electroless Cu plating onto Si in aqueous fluoride solution. 2007, Anais.. Pennington: The Electrochemical Society, 2007. Disponível em: https://doi.org/10.1149/1.2766884. Acesso em: 09 out. 2024. -
APA
Gozzi, G., & Santos Filho, S. G. dos. (2007). Dynamic scaling of the surface roughness during electroless Cu plating onto Si in aqueous fluoride solution. In SBMicro 2007. Pennington: The Electrochemical Society. doi:10.1149/1.2766884 -
NLM
Gozzi G, Santos Filho SG dos. Dynamic scaling of the surface roughness during electroless Cu plating onto Si in aqueous fluoride solution [Internet]. SBMicro 2007. 2007 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/1.2766884 -
Vancouver
Gozzi G, Santos Filho SG dos. Dynamic scaling of the surface roughness during electroless Cu plating onto Si in aqueous fluoride solution [Internet]. SBMicro 2007. 2007 ;[citado 2024 out. 09 ] Available from: https://doi.org/10.1149/1.2766884 - Formation and stability of Ni(Pt)Si/Poly-Si layered structure
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Informações sobre o DOI: 10.1149/1.2766884 (Fonte: oaDOI API)
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