Analysis of the etching mechanisms of tungsten in fluorine containing plasmas (1995)
- Authors:
- USP affiliated authors: SWART, JACOBUS WILLIBRORDUS - EP ; VERDONCK, PATRICK BERNARD - EP
- Unidade: EP
- Assunto: CIRCUITOS INTEGRADOS
- Language: Inglês
- Imprenta:
- Publisher place: Pennington
- Date published: 1995
- Source:
- Título: Journal of the Electrochemical Society
- Volume/Número/Paginação/Ano: v. 142, n. 6 , p. 1971-6, jun. 1995
-
ABNT
VERDONCK, Patrick Bernard et al. Analysis of the etching mechanisms of tungsten in fluorine containing plasmas. Journal of the Electrochemical Society, v. 142, n. ju 1995, p. 1971-6, 1995Tradução . . Acesso em: 13 fev. 2026. -
APA
Verdonck, P. B., Swart, J. W., Brasseur, G., & De Geyter, P. (1995). Analysis of the etching mechanisms of tungsten in fluorine containing plasmas. Journal of the Electrochemical Society, 142( ju 1995), 1971-6. -
NLM
Verdonck PB, Swart JW, Brasseur G, De Geyter P. Analysis of the etching mechanisms of tungsten in fluorine containing plasmas. Journal of the Electrochemical Society. 1995 ; 142( ju 1995): 1971-6.[citado 2026 fev. 13 ] -
Vancouver
Verdonck PB, Swart JW, Brasseur G, De Geyter P. Analysis of the etching mechanisms of tungsten in fluorine containing plasmas. Journal of the Electrochemical Society. 1995 ; 142( ju 1995): 1971-6.[citado 2026 fev. 13 ] - Chemical etching of tungsten with nf3 - 02 plasmas
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