Effect of stencil alignment on the solder beading in SMT process (2002)
- Authors:
- Autor USP: OKA, MAURICIO MASSAZUMI - EP
- Unidade: EP
- Assunto: MICROELETRÔNICA
- Language: Inglês
- Imprenta:
- Publisher: The Electrochemical Society
- Publisher place: Pennington
- Date published: 2002
- Source:
- Conference titles: International Symposium on Microelectronics Technology and Devices SBMICRO 2002, Porto Alegre, 2002
-
ABNT
SILVA, Flávio Sousa e OKA, Mauricio Massazumi. Effect of stencil alignment on the solder beading in SMT process. Microelectronics Technology and Devices SBMICRO 2002. Tradução . Pennington: The Electrochemical Society, 2002. . . Acesso em: 19 out. 2024. -
APA
Silva, F. S., & Oka, M. M. (2002). Effect of stencil alignment on the solder beading in SMT process. In Microelectronics Technology and Devices SBMICRO 2002. Pennington: The Electrochemical Society. -
NLM
Silva FS, Oka MM. Effect of stencil alignment on the solder beading in SMT process. In: Microelectronics Technology and Devices SBMICRO 2002. Pennington: The Electrochemical Society; 2002. [citado 2024 out. 19 ] -
Vancouver
Silva FS, Oka MM. Effect of stencil alignment on the solder beading in SMT process. In: Microelectronics Technology and Devices SBMICRO 2002. Pennington: The Electrochemical Society; 2002. [citado 2024 out. 19 ] - Six sigma method applied for reflow soldering process in SMT (surface Mount Technology)
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