Source: Proceedings: ULIS 2009. Conference titles: International Conference on Ultimate Integration on Silicon. Unidade: EP
Assunto: MICROELETRÔNICA
ABNT
RODRIGUES, M et al. Impact of TiN metal gate thickness and the HsSiO nitridation on MuGFETs electrical performance. 2009, Anais.. New York: IEEE, 2009. . Acesso em: 09 out. 2024.APA
Rodrigues, M., Mercha, A., Simoen, E., Collaert, N., Claeys, C., & Martino, J. A. (2009). Impact of TiN metal gate thickness and the HsSiO nitridation on MuGFETs electrical performance. In Proceedings: ULIS 2009. New York: IEEE.NLM
Rodrigues M, Mercha A, Simoen E, Collaert N, Claeys C, Martino JA. Impact of TiN metal gate thickness and the HsSiO nitridation on MuGFETs electrical performance. Proceedings: ULIS 2009. 2009 ;[citado 2024 out. 09 ]Vancouver
Rodrigues M, Mercha A, Simoen E, Collaert N, Claeys C, Martino JA. Impact of TiN metal gate thickness and the HsSiO nitridation on MuGFETs electrical performance. Proceedings: ULIS 2009. 2009 ;[citado 2024 out. 09 ]