Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods (2020)
- Authors:
- Autor USP: MARTINEZ, GUSTAVO ARISTIDES SANTANA - EEL
- Unidade: EEL
- DOI: 10.3390/proceedings2020063012
- Subjects: TREFILAÇÃO; MÉTODO DOS ELEMENTOS FINITOS
- Keywords: multi-pass wire drawing process; Deform2D; fine ETP copper wire; slab method; finite element method
- Language: Inglês
- Abstract: Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in diameter. The analytical model and the finite element analysis (FEA) were performed to validate the pass schedule design. The initial wire was mechanically characterized, and the pass schedule design was stablished by the analytical method according to the specific criteria. The sequence of wiredrawing passes was modeled in the finite element method (FEM) software in order to analyze and validate the designed pass schedule. The combination of these methods allowed designing and validating the wiredrawing pass schedule to implement it in a real process with guaranteed results. This work contributes in showing a combined methodology for the design and virtual validation of the pass schedule in the case of multistage wiredrawing of ETP copper fine wires.
- Imprenta:
- Source:
- Título: Proceedings
- ISSN: 2504-3900
- Volume/Número/Paginação/Ano: v.63, n.1, p.1-11, 2020
- Este periódico é de assinatura
- Este artigo é de acesso aberto
- URL de acesso aberto
- Cor do Acesso Aberto: hybrid
- Licença: cc-by
-
ABNT
ALABANDA, Oscar Rodriguez et al. Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods. Proceedings, v. 63, n. 1, p. 1-11, 2020Tradução . . Disponível em: https://doi.org/10.3390/proceedings2020063012. Acesso em: 06 jun. 2025. -
APA
Alabanda, O. R., Molero, E., Tintelecan, M., Vaca, G. G., Romero, P. E., & Martinez, G. A. S. (2020). Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods. Proceedings, 63( 1), 1-11. doi:10.3390/proceedings2020063012 -
NLM
Alabanda OR, Molero E, Tintelecan M, Vaca GG, Romero PE, Martinez GAS. Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods [Internet]. Proceedings. 2020 ;63( 1): 1-11.[citado 2025 jun. 06 ] Available from: https://doi.org/10.3390/proceedings2020063012 -
Vancouver
Alabanda OR, Molero E, Tintelecan M, Vaca GG, Romero PE, Martinez GAS. Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods [Internet]. Proceedings. 2020 ;63( 1): 1-11.[citado 2025 jun. 06 ] Available from: https://doi.org/10.3390/proceedings2020063012 - The influences of the variable speed and internal die geometry on the performance of two commercial soluble oils in the drawing process of pure copper fine wire
- Zn-AL Anticorrosive Coating Adapted to Obtain Protected Steel Wires
- Study and analysis of the wiredrawing of CuZn37 wires via numerical simulations and slab method
- Integrated triz with qfd applied to automotive valve industry
- Drawing tantalum encapsulated in the cooper pipe
- Achieving a Toothed Gear on Presses
- Effect of die pressure on the lubricating regimes achieved in wire drawing
- Effect of Process Parameters in Copper‐Wire Drawing
- Study and analysis of the wiredrawing of CuZn37 wires via numerical simulations and slab method
- Influences of Different Die Bearing Geometries on the Wire-Drawing Process
Informações sobre o DOI: 10.3390/proceedings2020063012 (Fonte: oaDOI API)
How to cite
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
