Potentiostatic electrodeposition of Au-Sn alloys from a non-cyanide bath for soldering: influence of reagents concentrations (2010)
- Authors:
- Autor USP: SANTOS FILHO, SEBASTIAO GOMES DOS - EP
- Unidade: EP
- Subjects: ELETROQUÍMICA; CIRCUITOS INTEGRADOS
- Language: Inglês
- Imprenta:
- Publisher place: Porto Alegre
- Date published: 2010
- Source:
- Título: Journal of Integrated Circuits and Systems
- ISSN: 1807-1953
- Volume/Número/Paginação/Ano: v.5, n.2, p. 95-102, 2010
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ABNT
CARDOSO, Juliana Lopes e SANTOS FILHO, Sebastião Gomes dos. Potentiostatic electrodeposition of Au-Sn alloys from a non-cyanide bath for soldering: influence of reagents concentrations. Journal of Integrated Circuits and Systems, v. 5, n. 2, p. 95-102, 2010Tradução . . Acesso em: 29 dez. 2025. -
APA
Cardoso, J. L., & Santos Filho, S. G. dos. (2010). Potentiostatic electrodeposition of Au-Sn alloys from a non-cyanide bath for soldering: influence of reagents concentrations. Journal of Integrated Circuits and Systems, 5( 2), 95-102. -
NLM
Cardoso JL, Santos Filho SG dos. Potentiostatic electrodeposition of Au-Sn alloys from a non-cyanide bath for soldering: influence of reagents concentrations. Journal of Integrated Circuits and Systems. 2010 ;5( 2): 95-102.[citado 2025 dez. 29 ] -
Vancouver
Cardoso JL, Santos Filho SG dos. Potentiostatic electrodeposition of Au-Sn alloys from a non-cyanide bath for soldering: influence of reagents concentrations. Journal of Integrated Circuits and Systems. 2010 ;5( 2): 95-102.[citado 2025 dez. 29 ] - Formation and stability of Ni(Pt)Si/Poly-Si layered structure
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