Source: Journal of the Electrochemical Society. Unidade: EP
Assunto: CIRCUITOS INTEGRADOS
ABNT
SANTOS FILHO, Sebastião Gomes dos et al. A Less critical cleaning procedure for silicon wafers using diluted hf dip and boiling in isopropil alcohol as final steps. Journal of the Electrochemical Society, v. 142, n. 3 , p. 902-7, 1995Tradução . . Disponível em: https://doi.org/10.1149/1.2048555. Acesso em: 17 out. 2024.APA
Santos Filho, S. G. dos, Hasenack, C. M., Salay, L. C., & Mertens, P. W. (1995). A Less critical cleaning procedure for silicon wafers using diluted hf dip and boiling in isopropil alcohol as final steps. Journal of the Electrochemical Society, 142( 3 ), 902-7. doi:10.1149/1.2048555NLM
Santos Filho SG dos, Hasenack CM, Salay LC, Mertens PW. A Less critical cleaning procedure for silicon wafers using diluted hf dip and boiling in isopropil alcohol as final steps [Internet]. Journal of the Electrochemical Society. 1995 ;142( 3 ): 902-7.[citado 2024 out. 17 ] Available from: https://doi.org/10.1149/1.2048555Vancouver
Santos Filho SG dos, Hasenack CM, Salay LC, Mertens PW. A Less critical cleaning procedure for silicon wafers using diluted hf dip and boiling in isopropil alcohol as final steps [Internet]. Journal of the Electrochemical Society. 1995 ;142( 3 ): 902-7.[citado 2024 out. 17 ] Available from: https://doi.org/10.1149/1.2048555