Hidrogenated carbon films used as mask in wafer processing with integrated circuits: post-processing (2000)
- Authors:
- Autor USP: MANSANO, RONALDO DOMINGUES - EP
- Unidade: EP
- Assunto: CIRCUITOS INTEGRADOS
- Language: Inglês
- Imprenta:
- Source:
- ISSN: 1517-3542
-
ABNT
JARAMILLO OCAMPO, Juan Manuel e MANSANO, Ronaldo Domingues e CHARRY RODRIGUEZ, Edgar. Hidrogenated carbon films used as mask in wafer processing with integrated circuits: post-processing. . São Paulo: EPUSP. . Acesso em: 05 nov. 2024. , 2000 -
APA
Jaramillo Ocampo, J. M., Mansano, R. D., & Charry Rodriguez, E. (2000). Hidrogenated carbon films used as mask in wafer processing with integrated circuits: post-processing. São Paulo: EPUSP. -
NLM
Jaramillo Ocampo JM, Mansano RD, Charry Rodriguez E. Hidrogenated carbon films used as mask in wafer processing with integrated circuits: post-processing. 2000 ;[citado 2024 nov. 05 ] -
Vancouver
Jaramillo Ocampo JM, Mansano RD, Charry Rodriguez E. Hidrogenated carbon films used as mask in wafer processing with integrated circuits: post-processing. 2000 ;[citado 2024 nov. 05 ] - Deposition and characterization of indium-tin oxide thin films deposited by RF sputtering
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