ReP USP - Resultado da busca

Trabalho de evento-resumo
Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate (2005)
Shang, Xiaogang; Brandi, Sérgio Duarte
Conference titles: International Congress on Frontiers of Welding Science and Technology. Unidade: EP
Subjects: COBRE, SOLDAGEM
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
SHANG, Xiaogang e BRANDI, Sérgio Duarte. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. 2005, Anais.. Kolkata: The Indian Institute of Welding, 2005. Disponível em: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf. Acesso em: 09 out. 2024.
APA
Shang, X., & Brandi, S. D. (2005). Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. In . Kolkata: The Indian Institute of Welding. Recuperado de https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf
NLM
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf
Vancouver
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf
Trabalho de evento-resumo
A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate (2004)
Carreira Neto, Manoel; Brandi, Sérgio Duarte
Source: HTC-2004. Abstracts. Conference titles: International Conference High Temperature Capillarity. Unidade: EP
Subjects: SOLDAGEM, COBRE
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
CARREIRA NETO, Manoel e BRANDI, Sérgio Duarte. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate. 2004, Anais.. Genova: Institute and Enterphases, National Research Council, 2004. Disponível em: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf. Acesso em: 09 out. 2024.
APA
Carreira Neto, M., & Brandi, S. D. (2004). A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate. In HTC-2004. Abstracts. Genova: Institute and Enterphases, National Research Council. Recuperado de https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf
NLM
Carreira Neto M, Brandi SD. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf
Vancouver
Carreira Neto M, Brandi SD. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf
Relatorio tecnico
Effects of solder bath temperature and substrate sheet thickness on the wetting balance curve (2003)
Martorano, Katia Marques; Martorano, Marcelo de Aquino ; Brandi, Sérgio Duarte
Unidade: EP
Subjects: ESTANHO, COBRE, SOLDAGEM FRACA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
MARTORANO, Katia Marques e MARTORANO, Marcelo de Aquino e BRANDI, Sérgio Duarte. Effects of solder bath temperature and substrate sheet thickness on the wetting balance curve. . São Paulo: EPUSP. Disponível em: https://repositorio.usp.br/directbitstream/22ee4550-9345-4195-afb6-670ee05b56fd/BRANDI-2003-Effectofsolder.pdf. Acesso em: 09 out. 2024. , 2003
APA
Martorano, K. M., Martorano, M. de A., & Brandi, S. D. (2003). Effects of solder bath temperature and substrate sheet thickness on the wetting balance curve. São Paulo: EPUSP. Recuperado de https://repositorio.usp.br/directbitstream/22ee4550-9345-4195-afb6-670ee05b56fd/BRANDI-2003-Effectofsolder.pdf
NLM
Martorano KM, Martorano M de A, Brandi SD. Effects of solder bath temperature and substrate sheet thickness on the wetting balance curve [Internet]. 2003 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/22ee4550-9345-4195-afb6-670ee05b56fd/BRANDI-2003-Effectofsolder.pdf
Vancouver
Martorano KM, Martorano M de A, Brandi SD. Effects of solder bath temperature and substrate sheet thickness on the wetting balance curve [Internet]. 2003 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/22ee4550-9345-4195-afb6-670ee05b56fd/BRANDI-2003-Effectofsolder.pdf
Trabalho de evento
Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.) (2001)
Martorano, Katia Marques; Brandi, Sérgio Duarte
Source: Proceedings. Conference titles: International Technical Symposium on Packaging and Assembling. Unidade: EP
Assunto: COBRE
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
MARTORANO, Katia Marques e BRANDI, Sérgio Duarte. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). 2001, Anais.. São Paulo: IMAPS BRASIL, 2001. Disponível em: https://repositorio.usp.br/directbitstream/b613fc54-297c-428d-a6c2-0534fe0ced72/BRANDI-2001-Reactivewettingofcopper.pdf. Acesso em: 09 out. 2024.
APA
Martorano, K. M., & Brandi, S. D. (2001). Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). In Proceedings. São Paulo: IMAPS BRASIL. Recuperado de https://repositorio.usp.br/directbitstream/b613fc54-297c-428d-a6c2-0534fe0ced72/BRANDI-2001-Reactivewettingofcopper.pdf
NLM
Martorano KM, Brandi SD. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.) [Internet]. Proceedings. 2001 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/b613fc54-297c-428d-a6c2-0534fe0ced72/BRANDI-2001-Reactivewettingofcopper.pdf
Vancouver
Martorano KM, Brandi SD. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.) [Internet]. Proceedings. 2001 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/b613fc54-297c-428d-a6c2-0534fe0ced72/BRANDI-2001-Reactivewettingofcopper.pdf

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