ABNT
SHANG, Xiaogang e BRANDI, Sérgio Duarte. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. 2005, Anais.. Kolkata: The Indian Institute of Welding, 2005. Disponível em: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf. Acesso em: 09 out. 2024.APA
Shang, X., & Brandi, S. D. (2005). Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. In . Kolkata: The Indian Institute of Welding. Recuperado de https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdfNLM
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdfVancouver
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 out. 09 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf