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Artigo de periodico
Effect of gravity on phase transition for liquid–gas simulations (2023)
Czelusniak, Luiz Eduardo ; Cabezas Gómez, Luben ; Wagner, Alexander J
Source: Physics of Fluids. Unidade: EESC
Subjects: ESCOAMENTO BIFÁSICO, TRANSFERÊNCIA DE CALOR, ENGENHARIA MECÂNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
CZELUSNIAK, Luiz Eduardo e CABEZAS GÓMEZ, Luben e WAGNER, Alexander J. Effect of gravity on phase transition for liquid–gas simulations. Physics of Fluids, v. 35, p. 1-15, 2023Tradução . . Disponível em: https://doi.org/10.1063/5.0144470. Acesso em: 07 ago. 2024.
APA
Czelusniak, L. E., Cabezas Gómez, L., & Wagner, A. J. (2023). Effect of gravity on phase transition for liquid–gas simulations. Physics of Fluids, 35, 1-15. doi:10.1063/5.0144470
NLM
Czelusniak LE, Cabezas Gómez L, Wagner AJ. Effect of gravity on phase transition for liquid–gas simulations [Internet]. Physics of Fluids. 2023 ; 35 1-15.[citado 2024 ago. 07 ] Available from: https://doi.org/10.1063/5.0144470
Vancouver
Czelusniak LE, Cabezas Gómez L, Wagner AJ. Effect of gravity on phase transition for liquid–gas simulations [Internet]. Physics of Fluids. 2023 ; 35 1-15.[citado 2024 ago. 07 ] Available from: https://doi.org/10.1063/5.0144470
Trabalho de evento-resumo
High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture (2021)
Alvarez, H. S.; Cioldim, F. H.; Silva, A. R.; Diniz, J. A.
Source: Abstracts. Conference titles: Workshop on Semiconductors and Micro and Nano Technology - SEMINATEC. Unidade: EESC
Subjects: TRANSFERÊNCIA DE CALOR, CIRCUITOS INTEGRADOS, MICROELETRÔNICA, ENGENHARIA MECÂNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
ALVAREZ, H. S. et al. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture. 2021, Anais.. São Paulo, SP: SBMicro, 2021. Disponível em: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf. Acesso em: 07 ago. 2024.
APA
Alvarez, H. S., Cioldim, F. H., Silva, A. R., & Diniz, J. A. (2021). High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture. In Abstracts. São Paulo, SP: SBMicro. Recuperado de https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf
NLM
Alvarez HS, Cioldim FH, Silva AR, Diniz JA. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture [Internet]. Abstracts. 2021 ;[citado 2024 ago. 07 ] Available from: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf
Vancouver
Alvarez HS, Cioldim FH, Silva AR, Diniz JA. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture [Internet]. Abstracts. 2021 ;[citado 2024 ago. 07 ] Available from: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf
Trabalho de evento-resumo
Silicon micro-channel definition via ICP plasma etching process using different hard masks (2019)
Alvarez, Hugo da S.; Diniz, J. A.; Ruiz, C. S.; Silva, Audrey R; Cioldin, Frederico H.; Nascimento Junior, Valter Salles do
Source: Abstract Book. Conference titles: AVS International Symposium and Exhibition. Unidade: EESC
Subjects: TRANSFERÊNCIA DE CALOR, RUGOSIDADE SUPERFICIAL, ENGENHARIA MECÂNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
ALVAREZ, Hugo da S. et al. Silicon micro-channel definition via ICP plasma etching process using different hard masks. 2019, Anais.. New York, NY, USA: AVS, 2019. Disponível em: https://repositorio.usp.br/directbitstream/030529e6-c5ac-454e-91a8-d19bf7dd63ef/PROD_26260_SYSNO_3153073%20%281%29.pdf. Acesso em: 07 ago. 2024.
APA
Alvarez, H. da S., Diniz, J. A., Ruiz, C. S., Silva, A. R., Cioldin, F. H., & Nascimento Junior, V. S. do. (2019). Silicon micro-channel definition via ICP plasma etching process using different hard masks. In Abstract Book. New York, NY, USA: AVS. Recuperado de https://repositorio.usp.br/directbitstream/030529e6-c5ac-454e-91a8-d19bf7dd63ef/PROD_26260_SYSNO_3153073%20%281%29.pdf
NLM
Alvarez H da S, Diniz JA, Ruiz CS, Silva AR, Cioldin FH, Nascimento Junior VS do. Silicon micro-channel definition via ICP plasma etching process using different hard masks [Internet]. Abstract Book. 2019 ;[citado 2024 ago. 07 ] Available from: https://repositorio.usp.br/directbitstream/030529e6-c5ac-454e-91a8-d19bf7dd63ef/PROD_26260_SYSNO_3153073%20%281%29.pdf
Vancouver
Alvarez H da S, Diniz JA, Ruiz CS, Silva AR, Cioldin FH, Nascimento Junior VS do. Silicon micro-channel definition via ICP plasma etching process using different hard masks [Internet]. Abstract Book. 2019 ;[citado 2024 ago. 07 ] Available from: https://repositorio.usp.br/directbitstream/030529e6-c5ac-454e-91a8-d19bf7dd63ef/PROD_26260_SYSNO_3153073%20%281%29.pdf

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