Reyes Betanzo, C; Moshkalyov, Stanislav A; Seabra, Antonio Carlos 
; Swart, Jacobus Willibrordus
Fonte: Microelectronic Technology and Devices SBMicro 2003. Unidade: EP
Assunto: MICROELETRÔNICA
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REYES BETANZO, C et al. Fabrication of submicron structures in polycristalline silicon by reactive ion etching using fluorine- and chlorine- containing plasmas. Microelectronic Technology and Devices SBMicro 2003. Tradução . Pennington: Electrochemical Society, 2003. . . Acesso em: 16 nov. 2025.APA
Reyes Betanzo, C., Moshkalyov, S. A., Seabra, A. C., & Swart, J. W. (2003). Fabrication of submicron structures in polycristalline silicon by reactive ion etching using fluorine- and chlorine- containing plasmas. In Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society.NLM
Reyes Betanzo C, Moshkalyov SA, Seabra AC, Swart JW. Fabrication of submicron structures in polycristalline silicon by reactive ion etching using fluorine- and chlorine- containing plasmas. In: Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society; 2003. [citado 2025 nov. 16 ]Vancouver
Reyes Betanzo C, Moshkalyov SA, Seabra AC, Swart JW. Fabrication of submicron structures in polycristalline silicon by reactive ion etching using fluorine- and chlorine- containing plasmas. In: Microelectronic Technology and Devices SBMicro 2003. Pennington: Electrochemical Society; 2003. [citado 2025 nov. 16 ]
