A new mechanism for silicon etching with fluorine based plasmas (2000)
Verdonck, Patrick Bernard; Goodyear, A.; Mansano, Ronaldo Domingues 
; Barroy, P.R.J.; Braithwaite, N.St.J.
Fonte: SBMicro 2000: proceedings. Nome do evento: International Conference on Microelectronics and Packaging. Unidade: EP
Assunto: CIRCUITOS INTEGRADOS
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VERDONCK, Patrick Bernard et al. A new mechanism for silicon etching with fluorine based plasmas. 2000, Anais.. Manaus: SBMicro/UA/UFRGS/UNICAMP/USP, 2000. . Acesso em: 15 nov. 2025.APA
Verdonck, P. B., Goodyear, A., Mansano, R. D., Barroy, P. R. J., & Braithwaite, N. S. J. (2000). A new mechanism for silicon etching with fluorine based plasmas. In SBMicro 2000: proceedings. Manaus: SBMicro/UA/UFRGS/UNICAMP/USP.NLM
Verdonck PB, Goodyear A, Mansano RD, Barroy PRJ, Braithwaite NSJ. A new mechanism for silicon etching with fluorine based plasmas. SBMicro 2000: proceedings. 2000 ;[citado 2025 nov. 15 ]Vancouver
Verdonck PB, Goodyear A, Mansano RD, Barroy PRJ, Braithwaite NSJ. A new mechanism for silicon etching with fluorine based plasmas. SBMicro 2000: proceedings. 2000 ;[citado 2025 nov. 15 ]
