Monlevade, Eduardo Franco de 
; Cardoso, Idélcio Alexandre Palheta; Souza, Gilberto Francisco Martha de
Fonte: Engineering Failure Analysis. Unidade: EP
Assuntos: CIRCUITOS IMPRESSOS, RESISTÊNCIA
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MONLEVADE, Eduardo Franco de e CARDOSO, Idélcio Alexandre Palheta e SOUZA, Gilberto Francisco Martha de. A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test. Engineering Failure Analysis, v. 128, p. 1-18, 2021Tradução . . Disponível em: https://doi.org/10.1016/j.engfailanal.2021.105578. Acesso em: 11 set. 2024.APA
Monlevade, E. F. de, Cardoso, I. A. P., & Souza, G. F. M. de. (2021). A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test. Engineering Failure Analysis, 128, 1-18. doi:10.1016/j.engfailanal.2021.105578NLM
Monlevade EF de, Cardoso IAP, Souza GFM de. A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test [Internet]. Engineering Failure Analysis. 2021 ;128 1-18.[citado 2024 set. 11 ] Available from: https://doi.org/10.1016/j.engfailanal.2021.105578Vancouver
Monlevade EF de, Cardoso IAP, Souza GFM de. A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test [Internet]. Engineering Failure Analysis. 2021 ;128 1-18.[citado 2024 set. 11 ] Available from: https://doi.org/10.1016/j.engfailanal.2021.105578
