Source: Microelectronics technology and devices, SBMicro. Conference titles: International Symposium on Microelectronics Technology and Devices. Unidade: EP
Assunto: MICROELETRÔNICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
ITOCAZU, Vitor Tatsuo et al. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. 2012, Anais.. Pennington: Escola Politécnica, Universidade de São Paulo, 2012. Disponível em: https://doi.org/10.1149/04901.0511ecst. Acesso em: 22 ago. 2024.APA
Itocazu, V. T., Sonnenberg, V., Simoen, E., Claeys, C., & Martino, J. A. (2012). Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. In Microelectronics technology and devices, SBMicro. Pennington: Escola Politécnica, Universidade de São Paulo. doi:10.1149/04901.0511ecstNLM
Itocazu VT, Sonnenberg V, Simoen E, Claeys C, Martino JA. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 ago. 22 ] Available from: https://doi.org/10.1149/04901.0511ecstVancouver
Itocazu VT, Sonnenberg V, Simoen E, Claeys C, Martino JA. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 ago. 22 ] Available from: https://doi.org/10.1149/04901.0511ecst