Itocazu, Vitor Tatsuo 
; Sonnenberg, Victor ; Simoen, Eddy ; Claeys, Cor ; Martino, João Antonio
Source: Microelectronics technology and devices, SBMicro. Conference titles: International Symposium on Microelectronics Technology and Devices. Unidade: EP
Assunto: MICROELETRÔNICA
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ABNT
ITOCAZU, Vitor Tatsuo et al. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. 2012, Anais.. Pennington: Escola Politécnica, Universidade de São Paulo, 2012. Disponível em: https://doi.org/10.1149/04901.0511ecst. Acesso em: 22 ago. 2024.APA
Itocazu, V. T., Sonnenberg, V., Simoen, E., Claeys, C., & Martino, J. A. (2012). Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. In Microelectronics technology and devices, SBMicro. Pennington: Escola Politécnica, Universidade de São Paulo. doi:10.1149/04901.0511ecstNLM
Itocazu VT, Sonnenberg V, Simoen E, Claeys C, Martino JA. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 ago. 22 ] Available from: https://doi.org/10.1149/04901.0511ecstVancouver
Itocazu VT, Sonnenberg V, Simoen E, Claeys C, Martino JA. Analysis of the silicon film thickness and the ground plane influence on ultra thin buried oxide SOI nMOSFETs. [Internet]. Microelectronics technology and devices, SBMicro. 2012 ;[citado 2024 ago. 22 ] Available from: https://doi.org/10.1149/04901.0511ecst
