Fonte: Physica Status Solidi C. Unidade: EP
Assuntos: FILMES FINOS, SEMICONDUTORES, METAIS, PROCESSOS DE MICROELETRÔNICA, SISTEMAS MICROELETROMECÂNICOS
ABNT
OLIVEIRA, Alessandro Ricardo e PEREYRA, Inés e PÁEZ CARREÑO, Marcelo Nelson. A study of metal contact properties on thermal annealed PECVD SiC thin films for MEMS applications. Physica Status Solidi C, v. 7, n. 3/4, p. 793-796, 2010Tradução . . Disponível em: https://doi.org/10.1002/pssc.200982839. Acesso em: 01 nov. 2024.APA
Oliveira, A. R., Pereyra, I., & Páez Carreño, M. N. (2010). A study of metal contact properties on thermal annealed PECVD SiC thin films for MEMS applications. Physica Status Solidi C, 7( 3/4), 793-796. doi:10.1002/pssc.200982839NLM
Oliveira AR, Pereyra I, Páez Carreño MN. A study of metal contact properties on thermal annealed PECVD SiC thin films for MEMS applications [Internet]. Physica Status Solidi C. 2010 ; 7( 3/4): 793-796.[citado 2024 nov. 01 ] Available from: https://doi.org/10.1002/pssc.200982839Vancouver
Oliveira AR, Pereyra I, Páez Carreño MN. A study of metal contact properties on thermal annealed PECVD SiC thin films for MEMS applications [Internet]. Physica Status Solidi C. 2010 ; 7( 3/4): 793-796.[citado 2024 nov. 01 ] Available from: https://doi.org/10.1002/pssc.200982839