Benegra, Marjorie 
; Lamas, D G; Fernández de Rapp, M E; Mingolo, N; Kunrath, A O; Souza, Roberto Martins de
Fonte: Thin Solid Films. Unidade: EP
Assuntos: FILMES FINOS, TENSÃO RESIDUAL, RESISTÊNCIA DOS MATERIAIS, PLASMA (PROCESSOS), TITÂNIO, NITRATOS
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BENEGRA, Marjorie et al. Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering. Thin Solid Films, v. 494, n. Ja 2006, p. 146-150, 2006Tradução . . Disponível em: https://doi.org/10.1016/j.tsf.2005.08.214. Acesso em: 02 ago. 2024.APA
Benegra, M., Lamas, D. G., Fernández de Rapp, M. E., Mingolo, N., Kunrath, A. O., & Souza, R. M. de. (2006). Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering. Thin Solid Films, 494( Ja 2006), 146-150. doi:10.1016/j.tsf.2005.08.214NLM
Benegra M, Lamas DG, Fernández de Rapp ME, Mingolo N, Kunrath AO, Souza RM de. Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering [Internet]. Thin Solid Films. 2006 ; 494( Ja 2006): 146-150.[citado 2024 ago. 02 ] Available from: https://doi.org/10.1016/j.tsf.2005.08.214Vancouver
Benegra M, Lamas DG, Fernández de Rapp ME, Mingolo N, Kunrath AO, Souza RM de. Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering [Internet]. Thin Solid Films. 2006 ; 494( Ja 2006): 146-150.[citado 2024 ago. 02 ] Available from: https://doi.org/10.1016/j.tsf.2005.08.214
