Source: Proceedings. Conference titles: International Technical Symposium on Packaging and Assembling. Unidade: EP
Assunto: COBRE
ABNT
MARTORANO, Katia Marques e BRANDI, Sérgio Duarte. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). 2001, Anais.. São Paulo: IMAPS BRASIL, 2001. . Acesso em: 02 ago. 2024.APA
Martorano, K. M., & Brandi, S. D. (2001). Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). In Proceedings. São Paulo: IMAPS BRASIL.NLM
Martorano KM, Brandi SD. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). Proceedings. 2001 ;[citado 2024 ago. 02 ]Vancouver
Martorano KM, Brandi SD. Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.). Proceedings. 2001 ;[citado 2024 ago. 02 ]