On a simple, stable and efficient bond model for inter-particle adhesion (2022)
- Authors:
- USP affiliated authors: CAMPELLO, EDUARDO DE MORAIS BARRETO - EP ; RUIZ, OSVALDO DARIO QUINTANA - EP
- Unidade: EP
- DOI: 10.1007/s40571-021-00388-z
- Subjects: SISTEMAS DINÂMICOS; DINÂMICA DAS ESTRUTURAS
- Agências de fomento:
- Language: Inglês
- Imprenta:
- Source:
- Título: Computational Particle Mechanics
- ISSN: 2196-4386
- Volume/Número/Paginação/Ano: v. 9, n. 1, p. 29–44, Feb. 2022
- Status:
- Nenhuma versão em acesso aberto identificada
-
ABNT
CAMPELLO, Eduardo de Morais Barreto e QUINTANA RUIZ, Osvaldo Dario. On a simple, stable and efficient bond model for inter-particle adhesion. Computational Particle Mechanics, v. 9, n. 1, p. 29–44, 2022Tradução . . Disponível em: https://doi.org/10.1007/s40571-021-00388-z. Acesso em: 31 mar. 2026. -
APA
Campello, E. de M. B., & Quintana Ruiz, O. D. (2022). On a simple, stable and efficient bond model for inter-particle adhesion. Computational Particle Mechanics, 9( 1), 29–44. doi:10.1007/s40571-021-00388-z -
NLM
Campello E de MB, Quintana Ruiz OD. On a simple, stable and efficient bond model for inter-particle adhesion [Internet]. Computational Particle Mechanics. 2022 ; 9( 1): 29–44.[citado 2026 mar. 31 ] Available from: https://doi.org/10.1007/s40571-021-00388-z -
Vancouver
Campello E de MB, Quintana Ruiz OD. On a simple, stable and efficient bond model for inter-particle adhesion [Internet]. Computational Particle Mechanics. 2022 ; 9( 1): 29–44.[citado 2026 mar. 31 ] Available from: https://doi.org/10.1007/s40571-021-00388-z - A methodology to predict the effective thermal conductivity of a granular assembly using deep learning
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