Source: Abstracts. Conference titles: Electrochemical Society Meeting. Unidade: IQ
Subjects: FÍSICO-QUÍMICA, ELETROQUÍMICA
ABNT
MYUNG, N et al. Electrodeposition kinetics of copper thin films from a nickel sulfamate bath containig copper sulfate. 1996, Anais.. Los Angeles: Instituto de Química, Universidade de São Paulo, 1996. . Acesso em: 28 set. 2024.APA
Myung, N., Momblanco, R., Kim, G. J., & Sumodjo, P. T. A. (1996). Electrodeposition kinetics of copper thin films from a nickel sulfamate bath containig copper sulfate. In Abstracts. Los Angeles: Instituto de Química, Universidade de São Paulo.NLM
Myung N, Momblanco R, Kim GJ, Sumodjo PTA. Electrodeposition kinetics of copper thin films from a nickel sulfamate bath containig copper sulfate. Abstracts. 1996 ;[citado 2024 set. 28 ]Vancouver
Myung N, Momblanco R, Kim GJ, Sumodjo PTA. Electrodeposition kinetics of copper thin films from a nickel sulfamate bath containig copper sulfate. Abstracts. 1996 ;[citado 2024 set. 28 ]