Resin bond cbn wheels wear analysis through the chip geometry (1995)
Source: Technical Paper Mr95-164. Conference titles: International Machining and Grinding Conference. Unidade: EESC
Assunto: ENGENHARIA MECÂNICA
ABNT
OLIVEIRA, João Fernando Gomes de e BIANCHI, E C e SOUZA, G F. Resin bond cbn wheels wear analysis through the chip geometry. 1995, Anais.. Dearborn: Society of Manufacturing Engineers, 1995. . Acesso em: 31 out. 2024.APA
Oliveira, J. F. G. de, Bianchi, E. C., & Souza, G. F. (1995). Resin bond cbn wheels wear analysis through the chip geometry. In Technical Paper Mr95-164. Dearborn: Society of Manufacturing Engineers.NLM
Oliveira JFG de, Bianchi EC, Souza GF. Resin bond cbn wheels wear analysis through the chip geometry. Technical Paper Mr95-164. 1995 ;[citado 2024 out. 31 ]Vancouver
Oliveira JFG de, Bianchi EC, Souza GF. Resin bond cbn wheels wear analysis through the chip geometry. Technical Paper Mr95-164. 1995 ;[citado 2024 out. 31 ]