Testing of printed circuit board solder joints by speckle correlation techniques (1990)
Source: Optics and Laser Technology. Unidade: IF
Assunto: ÓPTICA
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MURAMATSU, Mikiya e LUNAZZI, J J. Testing of printed circuit board solder joints by speckle correlation techniques. Optics and Laser Technology, v. 22, n. 4 , p. 260-2, 1990Tradução . . Disponível em: https://doi.org/10.1016/0030-3992(90)90057-b. Acesso em: 14 ago. 2024.APA
Muramatsu, M., & Lunazzi, J. J. (1990). Testing of printed circuit board solder joints by speckle correlation techniques. Optics and Laser Technology, 22( 4 ), 260-2. doi:10.1016/0030-3992(90)90057-bNLM
Muramatsu M, Lunazzi JJ. Testing of printed circuit board solder joints by speckle correlation techniques [Internet]. Optics and Laser Technology. 1990 ;22( 4 ): 260-2.[citado 2024 ago. 14 ] Available from: https://doi.org/10.1016/0030-3992(90)90057-bVancouver
Muramatsu M, Lunazzi JJ. Testing of printed circuit board solder joints by speckle correlation techniques [Internet]. Optics and Laser Technology. 1990 ;22( 4 ): 260-2.[citado 2024 ago. 14 ] Available from: https://doi.org/10.1016/0030-3992(90)90057-b
