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Artigo de periodico
Measurement system to determine the seebeck coefficient and electrical conductivity of thin films (2025)
Pereira, Gustavo Gonçalves Dalkiranis ; Bocchi, João Henrique Cirilo ; Torres, Bruno Bassi Millan ; Lopeandia-Fernández, Aitor ; Oliveira Junior, Osvaldo Novais de ; Faria, Gregório Couto
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: IFSC
Subjects: TERMOELETRICIDADE, CONDUTIVIDADE ELÉTRICA, FILMES FINOS
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ABNT
PEREIRA, Gustavo Gonçalves Dalkiranis et al. Measurement system to determine the seebeck coefficient and electrical conductivity of thin films. IEEE Transactions on Instrumentation and Measurement, v. 74, p. 1503706-1-1503706-6, 2025Tradução . . Disponível em: https://doi.org/10.1109/TIM.2025.3553254. Acesso em: 19 jun. 2025.
APA
Pereira, G. G. D., Bocchi, J. H. C., Torres, B. B. M., Lopeandia-Fernández, A., Oliveira Junior, O. N. de, & Faria, G. C. (2025). Measurement system to determine the seebeck coefficient and electrical conductivity of thin films. IEEE Transactions on Instrumentation and Measurement, 74, 1503706-1-1503706-6. doi:10.1109/TIM.2025.3553254
NLM
Pereira GGD, Bocchi JHC, Torres BBM, Lopeandia-Fernández A, Oliveira Junior ON de, Faria GC. Measurement system to determine the seebeck coefficient and electrical conductivity of thin films [Internet]. IEEE Transactions on Instrumentation and Measurement. 2025 ; 74 1503706-1-1503706-6.[citado 2025 jun. 19 ] Available from: https://doi.org/10.1109/TIM.2025.3553254
Vancouver
Pereira GGD, Bocchi JHC, Torres BBM, Lopeandia-Fernández A, Oliveira Junior ON de, Faria GC. Measurement system to determine the seebeck coefficient and electrical conductivity of thin films [Internet]. IEEE Transactions on Instrumentation and Measurement. 2025 ; 74 1503706-1-1503706-6.[citado 2025 jun. 19 ] Available from: https://doi.org/10.1109/TIM.2025.3553254
Artigo de periodico
A Comprehensive Analysis of the Influence of Thermal Insulating Materials on Arc Rating Tests (2025)
Bottaro, Márcio ; Caires, Luis Eduardo ; Obase, Paulo Futoshi ; Carvalho, Thais Ohara de ; Tatizawa, Hédio
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: IEE
Subjects: EQUIPAMENTO DE PROTEÇÃO INDIVIDUAL, CONDUTIVIDADE TÉRMICA
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ABNT
BOTTARO, Márcio et al. A Comprehensive Analysis of the Influence of Thermal Insulating Materials on Arc Rating Tests. IEEE Transactions on Instrumentation and Measurement, v. 74, p. art. 1500609/1-9, 2025Tradução . . Acesso em: 19 jun. 2025.
APA
Bottaro, M., Caires, L. E., Obase, P. F., Carvalho, T. O. de, & Tatizawa, H. (2025). A Comprehensive Analysis of the Influence of Thermal Insulating Materials on Arc Rating Tests. IEEE Transactions on Instrumentation and Measurement, 74, art. 1500609/1-9.
NLM
Bottaro M, Caires LE, Obase PF, Carvalho TO de, Tatizawa H. A Comprehensive Analysis of the Influence of Thermal Insulating Materials on Arc Rating Tests. IEEE Transactions on Instrumentation and Measurement. 2025 ; 74 art. 1500609/1-9.[citado 2025 jun. 19 ]
Vancouver
Bottaro M, Caires LE, Obase PF, Carvalho TO de, Tatizawa H. A Comprehensive Analysis of the Influence of Thermal Insulating Materials on Arc Rating Tests. IEEE Transactions on Instrumentation and Measurement. 2025 ; 74 art. 1500609/1-9.[citado 2025 jun. 19 ]
Artigo de periodico
Performance improvement of tomographic image reconstruction based on DSP processors (2009)
Cruvinel, Paulo E.; Pereira, Mauricio Fernando Lima; Saito, Jose Hiroki; Costa, Luciano da Fontoura
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: IFSC
Subjects: PROCESSAMENTO DE IMAGENS, TOMOGRAFIA (MEDIDAS), ARQUITETURA E ORGANIZAÇÃO DE COMPUTADORES
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ABNT
CRUVINEL, Paulo E. et al. Performance improvement of tomographic image reconstruction based on DSP processors. IEEE Transactions on Instrumentation and Measurement, v. 58, n. 9, p. 3295-3304, 2009Tradução . . Disponível em: https://doi.org/10.1109/TIM.2009.2022378. Acesso em: 19 jun. 2025.
APA
Cruvinel, P. E., Pereira, M. F. L., Saito, J. H., & Costa, L. da F. (2009). Performance improvement of tomographic image reconstruction based on DSP processors. IEEE Transactions on Instrumentation and Measurement, 58( 9), 3295-3304. doi:10.1109/TIM.2009.2022378
NLM
Cruvinel PE, Pereira MFL, Saito JH, Costa L da F. Performance improvement of tomographic image reconstruction based on DSP processors [Internet]. IEEE Transactions on Instrumentation and Measurement. 2009 ; 58( 9): 3295-3304.[citado 2025 jun. 19 ] Available from: https://doi.org/10.1109/TIM.2009.2022378
Vancouver
Cruvinel PE, Pereira MFL, Saito JH, Costa L da F. Performance improvement of tomographic image reconstruction based on DSP processors [Internet]. IEEE Transactions on Instrumentation and Measurement. 2009 ; 58( 9): 3295-3304.[citado 2025 jun. 19 ] Available from: https://doi.org/10.1109/TIM.2009.2022378
Artigo de periodico
Thermal characterization of an ultrasonic density - measurement cell (2007)
Higuti, Ricardo Tokio; Galindo, Bruno Shintate; Kitano, Cláudio; Buiochi, Flávio ; Adamowski, Júlio Cezar
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: EP
Subjects: DENSIDADE DOS LÍQUIDOS, TERMODINÂMICA, ULTRASSONOGRAFIA, SENSORES ELETROMECÂNICOS
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ABNT
HIGUTI, Ricardo Tokio et al. Thermal characterization of an ultrasonic density - measurement cell. IEEE Transactions on Instrumentation and Measurement, v. 56, n. 3, p. 924-930, 2007Tradução . . Disponível em: https://repositorio.usp.br/directbitstream/feaad582-9523-4ce0-86cb-fcd0a2c7bda1/Buiochi-2007-Thermal%20Characterization%20of%20an%20Ultrasonic%20Density-Measurement%20Cell%20%20ok.pdf. Acesso em: 19 jun. 2025.
APA
Higuti, R. T., Galindo, B. S., Kitano, C., Buiochi, F., & Adamowski, J. C. (2007). Thermal characterization of an ultrasonic density - measurement cell. IEEE Transactions on Instrumentation and Measurement, 56( 3), 924-930. Recuperado de https://repositorio.usp.br/directbitstream/feaad582-9523-4ce0-86cb-fcd0a2c7bda1/Buiochi-2007-Thermal%20Characterization%20of%20an%20Ultrasonic%20Density-Measurement%20Cell%20%20ok.pdf
NLM
Higuti RT, Galindo BS, Kitano C, Buiochi F, Adamowski JC. Thermal characterization of an ultrasonic density - measurement cell [Internet]. IEEE Transactions on Instrumentation and Measurement. 2007 ;56( 3): 924-930.[citado 2025 jun. 19 ] Available from: https://repositorio.usp.br/directbitstream/feaad582-9523-4ce0-86cb-fcd0a2c7bda1/Buiochi-2007-Thermal%20Characterization%20of%20an%20Ultrasonic%20Density-Measurement%20Cell%20%20ok.pdf
Vancouver
Higuti RT, Galindo BS, Kitano C, Buiochi F, Adamowski JC. Thermal characterization of an ultrasonic density - measurement cell [Internet]. IEEE Transactions on Instrumentation and Measurement. 2007 ;56( 3): 924-930.[citado 2025 jun. 19 ] Available from: https://repositorio.usp.br/directbitstream/feaad582-9523-4ce0-86cb-fcd0a2c7bda1/Buiochi-2007-Thermal%20Characterization%20of%20an%20Ultrasonic%20Density-Measurement%20Cell%20%20ok.pdf
Artigo de periodico
Analysis of linearity and frequency response of a novel piezoelectric flextensional actuator using a homodyne interferometer and the J1 - J4 method (2007)
Marçal, Luiz Antônio Perezi; Leão, José Vital Ferraz; Nader, Gilder; Higuti, Ricardo Tokio; Kitano, Cláudio; Silva, Emílio Carlos Nelli
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: EP
Subjects: ATUADORES PIEZELÉTRICOS, INTERFERÔMETROS, INSTRUMENTO ÓPTICO
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
MARÇAL, Luiz Antônio Perezi et al. Analysis of linearity and frequency response of a novel piezoelectric flextensional actuator using a homodyne interferometer and the J1 - J4 method. IEEE Transactions on Instrumentation and Measurement, v. 56, n. 3, 2007Tradução . . Disponível em: https://repositorio.usp.br/directbitstream/fa1f7e4a-cf51-481a-84c9-7dc9f52af2a3/Silva_E-2007-Analysis%20of%20Linearity%20and%20Frequency.pdf. Acesso em: 19 jun. 2025.
APA
Marçal, L. A. P., Leão, J. V. F., Nader, G., Higuti, R. T., Kitano, C., & Silva, E. C. N. (2007). Analysis of linearity and frequency response of a novel piezoelectric flextensional actuator using a homodyne interferometer and the J1 - J4 method. IEEE Transactions on Instrumentation and Measurement, 56( 3). Recuperado de https://repositorio.usp.br/directbitstream/fa1f7e4a-cf51-481a-84c9-7dc9f52af2a3/Silva_E-2007-Analysis%20of%20Linearity%20and%20Frequency.pdf
NLM
Marçal LAP, Leão JVF, Nader G, Higuti RT, Kitano C, Silva ECN. Analysis of linearity and frequency response of a novel piezoelectric flextensional actuator using a homodyne interferometer and the J1 - J4 method [Internet]. IEEE Transactions on Instrumentation and Measurement. 2007 ;56( 3):[citado 2025 jun. 19 ] Available from: https://repositorio.usp.br/directbitstream/fa1f7e4a-cf51-481a-84c9-7dc9f52af2a3/Silva_E-2007-Analysis%20of%20Linearity%20and%20Frequency.pdf
Vancouver
Marçal LAP, Leão JVF, Nader G, Higuti RT, Kitano C, Silva ECN. Analysis of linearity and frequency response of a novel piezoelectric flextensional actuator using a homodyne interferometer and the J1 - J4 method [Internet]. IEEE Transactions on Instrumentation and Measurement. 2007 ;56( 3):[citado 2025 jun. 19 ] Available from: https://repositorio.usp.br/directbitstream/fa1f7e4a-cf51-481a-84c9-7dc9f52af2a3/Silva_E-2007-Analysis%20of%20Linearity%20and%20Frequency.pdf
Artigo de periodico
A low cost and high-reliability communication protocol for remote monitoring devices (2004)
Garcia, Marcelo Alexandre; Villar, Reinaldo Serrano Goy; Cardoso, André Luis Rezemini; Moraes, José Carlos Teixeira de Barros
Source: IEEE Transactions on Instrumentation and Measurement. Unidade: EP
Assunto: INSTRUMENTAÇÃO ELÉTRICA
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
GARCIA, Marcelo Alexandre et al. A low cost and high-reliability communication protocol for remote monitoring devices. IEEE Transactions on Instrumentation and Measurement, v. 53, n. 2, p. 612-618, 2004Tradução . . Acesso em: 19 jun. 2025.
APA
Garcia, M. A., Villar, R. S. G., Cardoso, A. L. R., & Moraes, J. C. T. de B. (2004). A low cost and high-reliability communication protocol for remote monitoring devices. IEEE Transactions on Instrumentation and Measurement, 53( 2), 612-618.
NLM
Garcia MA, Villar RSG, Cardoso ALR, Moraes JCT de B. A low cost and high-reliability communication protocol for remote monitoring devices. IEEE Transactions on Instrumentation and Measurement. 2004 ;53( 2): 612-618.[citado 2025 jun. 19 ]
Vancouver
Garcia MA, Villar RSG, Cardoso ALR, Moraes JCT de B. A low cost and high-reliability communication protocol for remote monitoring devices. IEEE Transactions on Instrumentation and Measurement. 2004 ;53( 2): 612-618.[citado 2025 jun. 19 ]

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