Lourenço, Júlio Cesar 
; Souza, L P; Silva, G.; Suzuki, Paulo Atsushi ; Robin, Alain Laurent Marie; Nunes, Carlos Angelo ; Tomachuk, Celia R.
Source: International Journal of Electrochemical Science. Unidade: EEL
Subjects: SOLIDIFICAÇÃO, TEXTURA, ESTAMPAGEM
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LOURENÇO, Júlio Cesar et al. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy. International Journal of Electrochemical Science, v. 16, n. 10, p. 1-22, 2021Tradução . . Disponível em: https://doi.org/10.20964/2021.10.43. Acesso em: 05 nov. 2024.APA
Lourenço, J. C., Souza, L. P., Silva, G., Suzuki, P. A., Robin, A. L. M., Nunes, C. A., & Tomachuk, C. R. (2021). Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy. International Journal of Electrochemical Science, 16( 10), 1-22. doi:10.20964/2021.10.43NLM
Lourenço JC, Souza LP, Silva G, Suzuki PA, Robin ALM, Nunes CA, Tomachuk CR. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy [Internet]. International Journal of Electrochemical Science. 2021 ;16( 10): 1-22.[citado 2024 nov. 05 ] Available from: https://doi.org/10.20964/2021.10.43Vancouver
Lourenço JC, Souza LP, Silva G, Suzuki PA, Robin ALM, Nunes CA, Tomachuk CR. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy [Internet]. International Journal of Electrochemical Science. 2021 ;16( 10): 1-22.[citado 2024 nov. 05 ] Available from: https://doi.org/10.20964/2021.10.43
