Organic additive-copper (II) complexes as plating precursors (2009)
Watanabe, Rogério H.; Gois, Maurício C.; Lima Neto, Benedito dos Santos 
Source: Surface and Coatings Tecnhology. Unidade: IQSC
Subjects: QUÍMICA INORGÂNICA, COBRE
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WATANABE, Rogério H. e GOIS, Maurício C. e LIMA NETO, Benedito dos Santos. Organic additive-copper (II) complexes as plating precursors. Surface and Coatings Tecnhology, v. 204, n. 4, p. 497-502, 2009Tradução . . Disponível em: https://doi.org/10.1016/j.surfcoat.2009.08.020. Acesso em: 30 set. 2024.APA
Watanabe, R. H., Gois, M. C., & Lima Neto, B. dos S. (2009). Organic additive-copper (II) complexes as plating precursors. Surface and Coatings Tecnhology, 204( 4), 497-502. doi:10.1016/j.surfcoat.2009.08.020NLM
Watanabe RH, Gois MC, Lima Neto B dos S. Organic additive-copper (II) complexes as plating precursors [Internet]. Surface and Coatings Tecnhology. 2009 ; 204( 4): 497-502.[citado 2024 set. 30 ] Available from: https://doi.org/10.1016/j.surfcoat.2009.08.020Vancouver
Watanabe RH, Gois MC, Lima Neto B dos S. Organic additive-copper (II) complexes as plating precursors [Internet]. Surface and Coatings Tecnhology. 2009 ; 204( 4): 497-502.[citado 2024 set. 30 ] Available from: https://doi.org/10.1016/j.surfcoat.2009.08.020
