Metallic interconect reliability due to electromigration (1995)
Fonte: Proceedings. Nome do evento: Congress of the Brazilian Microelectronics Society. Unidade: EP
Assunto: CIRCUITOS INTEGRADOS
ABNT
MOLINA TORRES, L C. Metallic interconect reliability due to electromigration. 1995, Anais.. Porto Alegre: Instituto de Informatica da Ufrgs, 1995. . Acesso em: 05 set. 2024.APA
Molina Torres, L. C. (1995). Metallic interconect reliability due to electromigration. In Proceedings. Porto Alegre: Instituto de Informatica da Ufrgs.NLM
Molina Torres LC. Metallic interconect reliability due to electromigration. Proceedings. 1995 ;[citado 2024 set. 05 ]Vancouver
Molina Torres LC. Metallic interconect reliability due to electromigration. Proceedings. 1995 ;[citado 2024 set. 05 ]