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Filtros : "solidification" Limpar

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  • Artigo de periodico

    Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy (2021)

    Lourenço, Júlio Cesar ; Souza, L P; Silva, G.; Suzuki, Paulo Atsushi ; Robin, Alain Laurent Marie; Nunes, Carlos Angelo ; Tomachuk, Celia R.

    Source: International Journal of Electrochemical Science. Unidade: EEL

    Subjects: SOLIDIFICAÇÃO, TEXTURA, ESTAMPAGEM

    Acesso à fonteDOIHow to cite
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    • ABNT

      LOURENÇO, Júlio Cesar et al. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy. International Journal of Electrochemical Science, v. 16, n. 10, p. 1-22, 2021Tradução . . Disponível em: https://doi.org/10.20964/2021.10.43. Acesso em: 20 jan. 2026.

    • APA

      Lourenço, J. C., Souza, L. P., Silva, G., Suzuki, P. A., Robin, A. L. M., Nunes, C. A., & Tomachuk, C. R. (2021). Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy. International Journal of Electrochemical Science, 16( 10), 1-22. doi:10.20964/2021.10.43

    • NLM

      Lourenço JC, Souza LP, Silva G, Suzuki PA, Robin ALM, Nunes CA, Tomachuk CR. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy [Internet]. International Journal of Electrochemical Science. 2021 ;16( 10): 1-22.[citado 2026 jan. 20 ] Available from: https://doi.org/10.20964/2021.10.43

    • Vancouver

      Lourenço JC, Souza LP, Silva G, Suzuki PA, Robin ALM, Nunes CA, Tomachuk CR. Effects of Solidification, Rotary Swaging and Recrystallization on the Microstructure, Crystallographic Orientation and Electrochemical Behavior of an Al-4.5 wt.% Cu Alloy [Internet]. International Journal of Electrochemical Science. 2021 ;16( 10): 1-22.[citado 2026 jan. 20 ] Available from: https://doi.org/10.20964/2021.10.43

  • Artigo de periodico

    Solidification of Be-free Ni-based dental alloy (2018)

    Zupanic, Franc; Nunes, Carlos Angelo ; Coelho, Gilberto Carvalho ; Cury, Paula Letícia Corrêa de Toledo ; Lojen, Gorazd; Boncina, Tonica

    Source: Transactions of nonferrous metals society of china. Unidade: EEL

    Subjects: SOLIDIFICAÇÃO, NÍQUEL, LIGAS DENTÁRIAS

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    • ABNT

      ZUPANIC, Franc et al. Solidification of Be-free Ni-based dental alloy. Transactions of nonferrous metals society of china, v. 28, n. 11, p. 2226-2235, 2018Tradução . . Disponível em: https://doi.org/10.1016/S1003-6326(18)64867-8. Acesso em: 20 jan. 2026.

    • APA

      Zupanic, F., Nunes, C. A., Coelho, G. C., Cury, P. L. C. de T., Lojen, G., & Boncina, T. (2018). Solidification of Be-free Ni-based dental alloy. Transactions of nonferrous metals society of china, 28( 11), 2226-2235. doi:10.1016/S1003-6326(18)64867-8

    • NLM

      Zupanic F, Nunes CA, Coelho GC, Cury PLC de T, Lojen G, Boncina T. Solidification of Be-free Ni-based dental alloy [Internet]. Transactions of nonferrous metals society of china. 2018 ; 28( 11): 2226-2235.[citado 2026 jan. 20 ] Available from: https://doi.org/10.1016/S1003-6326(18)64867-8

    • Vancouver

      Zupanic F, Nunes CA, Coelho GC, Cury PLC de T, Lojen G, Boncina T. Solidification of Be-free Ni-based dental alloy [Internet]. Transactions of nonferrous metals society of china. 2018 ; 28( 11): 2226-2235.[citado 2026 jan. 20 ] Available from: https://doi.org/10.1016/S1003-6326(18)64867-8
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