Borato, Carlos Eduardo; Leite, Fábio L; Mattoso, Luiz Henrique Capparelli; Goy, Rejane Celi; Campana Filho, Sergio Paulo 
; Vasconcelos, Cláudio L de; Trindade Neto, Cypriano G da; Pereira, Márcia R; Fonseca, José L C; Oliveira Junior, Osvaldo Novais de
Source: IEEE Transactions on Dielectrics and Electrical Insulation. Unidades: IQSC, IFSC
Subjects: POLÍMEROS (MATERIAIS), FILMES FINOS
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BORATO, Carlos Eduardo et al. Layer-by-layer films of poly('ômicron'-ethoxyaniline), chitosan and chitosan-poly(methacrylic acid) nanoparticles and their application in an electronic tongue. IEEE Transactions on Dielectrics and Electrical Insulation, v. 13, n. 5, p. 1101-1109, 2006Tradução . . Disponível em: https://doi.org/10.1109/TDEI.2006.247838. Acesso em: 14 nov. 2024.APA
Borato, C. E., Leite, F. L., Mattoso, L. H. C., Goy, R. C., Campana Filho, S. P., Vasconcelos, C. L. de, et al. (2006). Layer-by-layer films of poly('ômicron'-ethoxyaniline), chitosan and chitosan-poly(methacrylic acid) nanoparticles and their application in an electronic tongue. IEEE Transactions on Dielectrics and Electrical Insulation, 13( 5), 1101-1109. doi:10.1109/TDEI.2006.247838NLM
Borato CE, Leite FL, Mattoso LHC, Goy RC, Campana Filho SP, Vasconcelos CL de, Trindade Neto CG da, Pereira MR, Fonseca JLC, Oliveira Junior ON de. Layer-by-layer films of poly('ômicron'-ethoxyaniline), chitosan and chitosan-poly(methacrylic acid) nanoparticles and their application in an electronic tongue [Internet]. IEEE Transactions on Dielectrics and Electrical Insulation. 2006 ; 13( 5): 1101-1109.[citado 2024 nov. 14 ] Available from: https://doi.org/10.1109/TDEI.2006.247838Vancouver
Borato CE, Leite FL, Mattoso LHC, Goy RC, Campana Filho SP, Vasconcelos CL de, Trindade Neto CG da, Pereira MR, Fonseca JLC, Oliveira Junior ON de. Layer-by-layer films of poly('ômicron'-ethoxyaniline), chitosan and chitosan-poly(methacrylic acid) nanoparticles and their application in an electronic tongue [Internet]. IEEE Transactions on Dielectrics and Electrical Insulation. 2006 ; 13( 5): 1101-1109.[citado 2024 nov. 14 ] Available from: https://doi.org/10.1109/TDEI.2006.247838
