Two-photon lithography for integrated photonic packaging (2023)
- Authors:
- Autor USP: MENDONÇA, CLEBER RENATO - IFSC
- Unidade: IFSC
- DOI: 10.37188/lam.2023.032
- Subjects: FOTÔNICA; ÓPTICA NÃO LINEAR; PROPRIEDADES DOS MATERIAIS
- Keywords: Photonic packaging; Two-photon lithography; Photonic wire bonding; Microoptics; Integrated photonics
- Agências de fomento:
- Language: Inglês
- Imprenta:
- Source:
- Título: Light: Advanced Manufacturing
- ISSN: 2689-9620
- Volume/Número/Paginação/Ano: v. 4, n. 32, p. 32-1-32-17, Nov. 2023
- Este periódico é de acesso aberto
- Este artigo NÃO é de acesso aberto
-
ABNT
YU, Shaoliang et al. Two-photon lithography for integrated photonic packaging. Light: Advanced Manufacturing, v. No 2023, n. 32, p. 32-1-32-17, 2023Tradução . . Disponível em: https://doi.org/10.37188/lam.2023.032. Acesso em: 23 jan. 2026. -
APA
Yu, S., Du, Q., Mendonça, C. R., Ranno, L., Gu, T., & Hu, J. (2023). Two-photon lithography for integrated photonic packaging. Light: Advanced Manufacturing, No 2023( 32), 32-1-32-17. doi:10.37188/lam.2023.032 -
NLM
Yu S, Du Q, Mendonça CR, Ranno L, Gu T, Hu J. Two-photon lithography for integrated photonic packaging [Internet]. Light: Advanced Manufacturing. 2023 ; No 2023( 32): 32-1-32-17.[citado 2026 jan. 23 ] Available from: https://doi.org/10.37188/lam.2023.032 -
Vancouver
Yu S, Du Q, Mendonça CR, Ranno L, Gu T, Hu J. Two-photon lithography for integrated photonic packaging [Internet]. Light: Advanced Manufacturing. 2023 ; No 2023( 32): 32-1-32-17.[citado 2026 jan. 23 ] Available from: https://doi.org/10.37188/lam.2023.032 - Ultrafast terahertz spectroscopy of gallium nitride thin films
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Informações sobre o DOI: 10.37188/lam.2023.032 (Fonte: oaDOI API)
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