Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions (2024)
- Authors:
- Autor USP: RIBATSKI, GHERHARDT - EESC
- Unidade: EESC
- DOI: 10.1016/j.applthermaleng.2023.121474
- Subjects: ELETRÔNICA DE POTÊNCIA; EVAPORAÇÃO; DISPOSITIVOS ELETRÔNICOS; ENGENHARIA MECÂNICA
- Agências de fomento:
- Language: Inglês
- Imprenta:
- Publisher: Elsevier
- Publisher place: Kidlington, United Kingdom
- Date published: 2024
- Source:
- Título: Applied Thermal Engineering
- ISSN: 1359-4311
- Volume/Número/Paginação/Ano: v. 236, article 121474, p. 1-13, 2024
- Este periódico é de assinatura
- Este artigo NÃO é de acesso aberto
- Cor do Acesso Aberto: closed
-
ABNT
RAKISHITH, Bairi Levi et al. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions. Applied Thermal Engineering, v. 236, p. 1-13, 2024Tradução . . Disponível em: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474. Acesso em: 02 out. 2024. -
APA
Rakishith, B. L., Asirvatham, L. G., Angeline, A. A., Raj, J. A. P. S., Bose, J. R., Princess, P. J. B., et al. (2024). Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions. Applied Thermal Engineering, 236, 1-13. doi:10.1016/j.applthermaleng.2023.121474 -
NLM
Rakishith BL, Asirvatham LG, Angeline AA, Raj JAPS, Bose JR, Princess PJB, Gautam S, Mahian O, Ribatski G, Wongwises S. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions [Internet]. Applied Thermal Engineering. 2024 ; 236 1-13.[citado 2024 out. 02 ] Available from: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474 -
Vancouver
Rakishith BL, Asirvatham LG, Angeline AA, Raj JAPS, Bose JR, Princess PJB, Gautam S, Mahian O, Ribatski G, Wongwises S. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions [Internet]. Applied Thermal Engineering. 2024 ; 236 1-13.[citado 2024 out. 02 ] Available from: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474 - A new correlation for single and two-phase flow pressure drop in round tubes with twisted-tape inserts
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Informações sobre o DOI: 10.1016/j.applthermaleng.2023.121474 (Fonte: oaDOI API)
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